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Atomic layer etching of niobium nitride using sequential exposures of O$_2$ and H$_2$/SF$_6$ plasmas
Authors:
Azmain A. Hossain,
Sela Murphy,
David S. Catherall,
Anthony J. Ardizzi,
Austin J. Minnich
Abstract:
Niobium nitride (NbN) is a metallic superconductor that is widely used for superconducting electronics due to its high transition temperature ($T_c$) and kinetic inductance. Processing-induced damage negatively affects the performance of these devices by mechanisms such as microwave surface loss. Atomic layer etching (ALE), with its ability to etch with Angstrom-scale control and low damage, has t…
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Niobium nitride (NbN) is a metallic superconductor that is widely used for superconducting electronics due to its high transition temperature ($T_c$) and kinetic inductance. Processing-induced damage negatively affects the performance of these devices by mechanisms such as microwave surface loss. Atomic layer etching (ALE), with its ability to etch with Angstrom-scale control and low damage, has the potential to address these issues, but no ALE process is known for NbN. Here, we report such a process consisting of sequential exposures of O$_2$ plasma and H$_2$/SF$_6$ plasma. Exposure to O$_2$ plasma rather than O$_2$ gas yields a greater fraction of Nb in the +5 oxidation state, which is then volatilized by NbF$_5$ formation with exposure to an H$_2$/SF$_6$ plasma. The SF$_6$:H$_2$ flow rate ratio is chosen to produce selective etching of Nb$_2$O$_5$ over NbN, enabling self-limiting etching within a cycle. An etch rate of 1.77 Å/cycle was measured at 125 $^\circ$C using ex-situ ellipsometry. The $T_c$ of the ALE-etched film is higher than that of an RIE-etched film of a similar thickness, highlighting the low-damage nature of the process. These findings have relevance for applications of NbN in single-photon detectors and superconducting microresonators.
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Submitted 24 February, 2025;
originally announced February 2025.
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Atomic layer etching of SiO$_2$ using sequential exposures of Al(CH$_3$)$_3$ and H$_2$/SF$_6$ plasma
Authors:
David Catherall,
Azmain Hossain,
Austin Minnich
Abstract:
On-chip photonic devices based on SiO$_2$ are of interest for applications such as microresonator gyroscopes and microwave sources. Although SiO$_2$ microdisk resonators have achieved quality factors exceeding one billion, this value remains an order of magnitude less than the intrinsic limit due to surface roughness scattering. Atomic layer etching (ALE) has potential to mitigate this scattering…
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On-chip photonic devices based on SiO$_2$ are of interest for applications such as microresonator gyroscopes and microwave sources. Although SiO$_2$ microdisk resonators have achieved quality factors exceeding one billion, this value remains an order of magnitude less than the intrinsic limit due to surface roughness scattering. Atomic layer etching (ALE) has potential to mitigate this scattering because of its ability to smooth surfaces to sub-nanometer length scales. While isotropic ALE processes for SiO$_2$ have been reported, they are not generally compatible with commercial reactors, and the effect on surface roughness has not been studied. Here, we report an ALE process for SiO$_2$ using sequential exposures of Al(CH$_3$)$_3$ (trimethylaluminum, TMA) and Ar/H$_2$/SF$_6$ plasma. We find that each process step is self-limiting, and that the overall process exhibits a synergy of 100%. We observe etch rates up to 0.58 Å per cycle for thermally-grown SiO$_2$ and higher rates for ALD, PECVD, and sputtered SiO$_2$ up to 2.38 Å per cycle. Furthermore, we observe a decrease in surface roughness by 62% on a roughened film. The residual concentration of Al and F is around 1-2%, which can be further decreased by O$_2$ plasma treatment. This process could find applications in smoothing of SiO$_2$ optical devices and thereby enabling device quality factors to approach limits set by intrinsic dissipation.
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Submitted 8 May, 2024;
originally announced May 2024.
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Isotropic atomic layer etching of MgO-doped lithium niobate using sequential exposures of H$_2$ and SF$_6$ plasmas
Authors:
Ivy I. Chen,
Jennifer Solgaard,
Ryoto Sekine,
Azmain A. Hossain,
Anthony Ardizzi,
David S. Catherall,
Alireza Marandi,
James R. Renzas,
Frank Greer,
Austin J. Minnich
Abstract:
Lithium niobate (LiNbO$_3$, LN) is a ferroelectric crystal of interest for integrated photonics owing to its large second-order optical nonlinearity and the ability to impart periodic poling via an external electric field. However, on-chip device performance based on thin-film lithium niobate (TFLN) is presently limited by propagation losses arising from surface roughness and corrugations. Atomic…
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Lithium niobate (LiNbO$_3$, LN) is a ferroelectric crystal of interest for integrated photonics owing to its large second-order optical nonlinearity and the ability to impart periodic poling via an external electric field. However, on-chip device performance based on thin-film lithium niobate (TFLN) is presently limited by propagation losses arising from surface roughness and corrugations. Atomic layer etching (ALE) could potentially smooth these features and thereby increase photonic performance, but no ALE process has been reported for LN. Here, we report an isotropic ALE process for $x$-cut MgO-doped LN using sequential exposures of H$_2$ and SF$_6$/Ar plasmas. We observe an etch rate of $1.59 \pm 0.02$ nm/cycle with a synergy of $96.9$%. We also demonstrate ALE can be achieved with SF$_6$/O$_2$ or Cl$_2$/BCl$_3$ plasma exposures in place of the SF$_6$/Ar plasma step with synergies of $99.5$% and $91.5$% respectively. The process is found to decrease the sidewall surface roughness of TFLN waveguides etched by physical Ar$^+$ milling by 30% without additional wet processing. Our ALE process could be used to smooth sidewall surfaces of TFLN waveguides as a post-processing treatment, thereby increasing the performance of TFLN nanophotonic devices and enabling new integrated photonic device capabilities.
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Submitted 5 October, 2024; v1 submitted 16 October, 2023;
originally announced October 2023.
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Isotropic plasma-thermal atomic layer etching of superconducting TiN films using sequential exposures of molecular oxygen and SF$_6/$H$_2$ plasma
Authors:
Azmain A. Hossain,
Haozhe Wang,
David S. Catherall,
Martin Leung,
Harm C. M. Knoops,
James R. Renzas,
Austin J. Minnich
Abstract:
Microwave loss in superconducting titanium nitride (TiN) films is attributed to two-level systems in various interfaces arising in part from oxidation and microfabrication-induced damage. Atomic layer etching (ALE) is an emerging subtractive fabrication method which is capable of etching with Angstrom-scale etch depth control and potentially less damage. However, while ALE processes for TiN have b…
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Microwave loss in superconducting titanium nitride (TiN) films is attributed to two-level systems in various interfaces arising in part from oxidation and microfabrication-induced damage. Atomic layer etching (ALE) is an emerging subtractive fabrication method which is capable of etching with Angstrom-scale etch depth control and potentially less damage. However, while ALE processes for TiN have been reported, they either employ HF vapor, incurring practical complications; or the etch rate lacks the desired control. Further, the superconducting characteristics of the etched films have not been characterized. Here, we report an isotropic plasma-thermal TiN ALE process consisting of sequential exposures to molecular oxygen and an SF$_6$/H$_2$ plasma. For certain ratios of SF$_6$:H$_2$ flow rates, we observe selective etching of TiO$_2$ over TiN, enabling self-limiting etching within a cycle. Etch rates were measured to vary from 1.1 Å/cycle at 150 $^\circ$C to 3.2 Å/cycle at 350 $^\circ$C using ex-situ ellipsometry. We demonstrate that the superconducting critical temperature of the etched film does not decrease beyond that expected from the decrease in film thickness, highlighting the low-damage nature of the process. These findings have relevance for applications of TiN in microwave kinetic inductance detectors and superconducting qubits.
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Submitted 6 July, 2023;
originally announced July 2023.
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Hot hole transport and noise phenomena in silicon at cryogenic temperatures from first principles
Authors:
David S. Catherall,
Austin J. Minnich
Abstract:
The transport properties of hot holes in silicon at cryogenic temperatures exhibit several anomalous features, including the emergence of two distinct saturated drift velocity regimes and a non-monotonic trend of the current noise versus electric field at microwave frequencies. Despite prior investigations, these features lack generally accepted explanations. Here, we examine the microscopic origi…
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The transport properties of hot holes in silicon at cryogenic temperatures exhibit several anomalous features, including the emergence of two distinct saturated drift velocity regimes and a non-monotonic trend of the current noise versus electric field at microwave frequencies. Despite prior investigations, these features lack generally accepted explanations. Here, we examine the microscopic origin of these phenomena by extending a recently developed ab-initio theory of high-field transport and noise in semiconductors. We find that the drift velocity anomaly may be attributed to scattering dominated by acoustic phonon emission, leading to an additional regime of drift velocity saturation at temperatures $\sim 40$ K for which the acoustic phonon occupation is negligible; while the non-monotonic trend in the current noise arises due to the decrease in momentum relaxation time with electric field. The former conclusion is consistent with the findings of prior work, but the latter distinctly differs from previous explanations. This work highlights the use of high-field transport and noise phenomena as sensitive probes of microscopic charge transport phenomena in semiconductors.
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Submitted 26 June, 2023;
originally announced June 2023.
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Isotropic plasma-thermal atomic layer etching of aluminum nitride using SF$_6$ plasma and Al(CH$_3$)$_3$
Authors:
Haozhe Wang,
Azmain Hossain,
David Catherall,
Austin J. Minnich
Abstract:
We report the isotropic plasma atomic layer etching (ALE) of aluminum nitride using sequential exposures of SF$_6$ plasma and trimethylaluminum (Al(CH$_3$)$_3$, TMA). ALE was observed at temperatures greater than 200 $^\circ$C, with a maximum etch rate of 1.9 Å/cycle observed at 300 $^\circ$C as measured using ex-situ ellipsometry. After ALE, the etched surface was found to contain a lower concent…
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We report the isotropic plasma atomic layer etching (ALE) of aluminum nitride using sequential exposures of SF$_6$ plasma and trimethylaluminum (Al(CH$_3$)$_3$, TMA). ALE was observed at temperatures greater than 200 $^\circ$C, with a maximum etch rate of 1.9 Å/cycle observed at 300 $^\circ$C as measured using ex-situ ellipsometry. After ALE, the etched surface was found to contain a lower concentration of oxygen compared to the original surface and exhibited a $\sim 35$% decrease in surface roughness. These findings have relevance for applications of AlN in nonlinear photonics and wide bandgap semiconductor devices.
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Submitted 7 November, 2022; v1 submitted 31 August, 2022;
originally announced September 2022.
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High-field charge transport and noise in p-Si from first principles
Authors:
David Catherall,
Austin Minnich
Abstract:
The parameter-free computation of charge transport properties of semiconductors is now routine owing to advances in the ab-initio description of the electron-phonon interaction. Many studies focus on the low-field regime in which the carrier temperature equals the lattice temperature and the current power spectral density (PSD) is proportional to the mobility. The calculation of high-field transpo…
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The parameter-free computation of charge transport properties of semiconductors is now routine owing to advances in the ab-initio description of the electron-phonon interaction. Many studies focus on the low-field regime in which the carrier temperature equals the lattice temperature and the current power spectral density (PSD) is proportional to the mobility. The calculation of high-field transport and noise properties offers a stricter test of the theory as these relations no longer hold, yet few such calculations have been reported. Here, we compute the high-field mobility and PSD of hot holes in silicon from first principles at temperatures of 77 and 300 K and electric fields up to 20 kV cm$^{-1}$ along various crystallographic axes. We find that the calculations quantitatively reproduce experimental trends including the anisotropy and electric-field dependence of hole mobility and PSD. The experimentally observed rapid variation of energy relaxation time with electric field at cryogenic temperatures is also correctly predicted. However, as in low-field studies, absolute quantitative agreement is in general lacking, a discrepancy that has been attributed to inaccuracies in the calculated valence band structure. Our work highlights the use of high-field transport and noise properties as a rigorous test of the theory of electron-phonon interactions in semiconductors.
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Submitted 1 November, 2022; v1 submitted 29 June, 2022;
originally announced June 2022.
