Cracking in polymer substrates for flexible devices and its mitigation
Authors:
Anush Ranka,
Madhuja Layek,
Sayaka Kochiyama,
Cristina Lopez-Pernia,
Alicia M. Chandler,
Conrad A. Kocoj,
Erica Magliano,
Aldo Di Carlo,
Francesca Brunetti,
Peijun Guo,
Subra Suresh,
David C. Paine,
Haneesh Kesari,
Nitin P. Padture
Abstract:
Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack…
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Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack easily. Contrary to this widespread assumption, here we reveal severe, pervasive, and extensive cracking in the polymer substrates during bending of electrode/substrate sheets, which compromises the overall mechanical integrity of the entire device. The substrate-cracking phenomenon appears to be general, and it is driven by the amplified stress intensity factor caused by the elastic mismatch at the film/substrate interface. To mitigate this substrate cracking, an interlayer-engineering approach is designed and experimentally demonstrated. This approach is generic, and it is potentially applicable to myriad flexible electronic devices that utilize stiff films on compliant substrates, for improving their durability and reliability.
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Submitted 14 April, 2025;
originally announced April 2025.
Matching the photocurrent of perovskite/organic tandem solar modules by varying the cell width
Authors:
Jose Garcia Cerrillo,
Andreas Distler,
Fabio Matteocci,
Karen Forberich,
Michael Wagner,
Robin Basu,
Luigi Angelo Castriotta,
Farshad Jafarzadeh,
Francesca Brunetti,
Fu Yang,
Ning Li,
Asiel Neftali Corpus Mendoza,
Aldo Di Carlo,
Christoph J. Brabec,
Hans-Joachim Egelhaaf
Abstract:
Photocurrent matching in conventional monolithic tandem solar cells is achieved by choosing semiconductors with complementary absorption spectra and by carefully adjusting the optical properties of the complete top and bottom stacks. However, for thin film photovoltaic technologies at the module level, another design variable significantly alleviates the task of photocurrent matching, namely the c…
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Photocurrent matching in conventional monolithic tandem solar cells is achieved by choosing semiconductors with complementary absorption spectra and by carefully adjusting the optical properties of the complete top and bottom stacks. However, for thin film photovoltaic technologies at the module level, another design variable significantly alleviates the task of photocurrent matching, namely the cell width, whose modification can be readily realized by the adjustment of the module layout. Herein we demonstrate this concept at the experimental level for the first time for a 2T-mechanically stacked perovskite (FAPbBr3)/organic (PM6:Y6:PCBM) tandem mini-module, an unprecedented approach for these emergent photovoltaic technologies fabricated in an independent manner. An excellent Isc matching is achieved by tuning the cell widths of the perovskite and organic modules to 7.22 mm (PCEPVKT-mod= 6.69%) and 3.19 mm (PCEOPV-mod= 12.46%), respectively, leading to a champion efficiency of 14.94% for the tandem module interconnected in series with an aperture area of 20.25 cm2. Rather than demonstrating high efficiencies at the level of small lab cells, our successful experimental proof-of-concept at the module level proves to be particularly useful to couple devices with non-complementary semiconductors, either in series or in parallel electrical connection, hence overcoming the limitations imposed by the monolithic structure.
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Submitted 22 September, 2023;
originally announced September 2023.
