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Transfer-free Grown Bilayer Graphene Transistors for Digital Applications
Authors:
Pia Juliane Wessely,
Frank Wessely,
Emrah Birinci,
Bernadette Riedinger,
Udo Schwalke
Abstract:
We invented a novel method to fabricate graphene transistors on oxidized silicon wafers without the need to transfer graphene layers. By means of catalytic chemical vapor deposition (CCVD) the in-situ grown bilayer graphene transistors (BiLGFETs) are realized directly on oxidized silicon substrate, whereby the number of stacked graphene layers is determined by the selected CCVD process parameters,…
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We invented a novel method to fabricate graphene transistors on oxidized silicon wafers without the need to transfer graphene layers. By means of catalytic chemical vapor deposition (CCVD) the in-situ grown bilayer graphene transistors (BiLGFETs) are realized directly on oxidized silicon substrate, whereby the number of stacked graphene layers is determined by the selected CCVD process parameters, e.g. temperature and gas mixture. BiLGFETs exhibit ultra-high on/off-current ratios of 107 at room temperature, exceeding previously reported values by several orders of magnitude. This will allow a simple and low-cost integration of graphene devices for digital nanoelectronic applications in a hybrid silicon CMOS environment for the first time.
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Submitted 31 May, 2012;
originally announced May 2012.
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Transfer-free fabrication of graphene transistors
Authors:
Pia Juliane Wessely,
Frank Wessely,
Emrah Birinci,
Bernadette Riedinger,
Udo Schwalke
Abstract:
We invented a method to fabricate graphene transistors on oxidized silicon wafers without the need to transfer graphene layers. To stimulate the growth of graphene layers on oxidized silicon a catalyst system of nanometer thin aluminum/nickel double layer is used. This catalyst system is structured via liftoff before the wafer enters the catalytic chemical vapor deposition (CCVD) chamber. In the s…
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We invented a method to fabricate graphene transistors on oxidized silicon wafers without the need to transfer graphene layers. To stimulate the growth of graphene layers on oxidized silicon a catalyst system of nanometer thin aluminum/nickel double layer is used. This catalyst system is structured via liftoff before the wafer enters the catalytic chemical vapor deposition (CCVD) chamber. In the subsequent methane based growth process monolayer graphene field-effect transistors (MoLGFETs) and bilayer graphene transistors (BiLGFETs) are realized directly on oxidized silicon substrate, whereby the number of stacked graphene layers is determined by the selected CCVD process parameters, e.g. temperature and gas mixture. Subsequently, Raman spectroscopy is performed within the channel region in between the catalytic areas and the Raman spectra of fivelayer, bilayer and monolayer graphene confirm the existence of graphene grown by this silicon-compatible, transfer-free and in-situ fabrication approach. These graphene FETs will allow a simple and low-cost integration of graphene devices for nanoelectronic applications in a hybrid silicon CMOS environment.
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Submitted 19 December, 2011;
originally announced December 2011.
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Silicon-CMOS Compatible In-Situ CCVD Grown Graphene Transistors with Ultra-High On/Off-Current Ratio
Authors:
Pia Juliane Wessely,
Frank Wessely,
Emrah Birinci,
Karsten Beckmann,
Bernadette Riedinger,
Udo Schwalke
Abstract:
By means of catalytic chemical vapor deposition (CCVD) in-situ grown monolayer graphene field-effect transistors (MoLGFETs) and bilayer graphene transistors (BiLGFETs) are realized directly on oxidized silicon substrate without the need to transfer graphene layers. In-situ grown MoLGFETs exhibit the expected Dirac point together with the typical low on/off-current ratios. In contrast, BiLGFETs pos…
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By means of catalytic chemical vapor deposition (CCVD) in-situ grown monolayer graphene field-effect transistors (MoLGFETs) and bilayer graphene transistors (BiLGFETs) are realized directly on oxidized silicon substrate without the need to transfer graphene layers. In-situ grown MoLGFETs exhibit the expected Dirac point together with the typical low on/off-current ratios. In contrast, BiLGFETs possess unipolar p-type device characteristics with an extremely high on/off-current ratio up to 1E7. The complete fabrication process is silicon CMOS compatible. This will allow a simple and low-cost integration of graphene devices for nanoelectronic applications in a hybrid silicon CMOS environment.
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Submitted 28 November, 2011;
originally announced November 2011.
