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AstroPix: A Pixelated HVCMOS Sensor for Space-Based Gamma-Ray Measurement
Authors:
Amanda L. Steinhebel,
Regina Caputo,
Daniel P. Violette,
Anthony Affolder,
Autumn Bauman,
Carolyn Chinatti,
Aware Deshmukh,
Vitaliy Fadayev,
Yasushi Fukazawa,
Manoj Jadhav,
Carolyn Kierans,
Bobae Kim,
Jihee Kim,
Henry Klest,
Olivia Kroger,
Kavic Kumar,
Shin Kushima,
Jean-Marie Lauenstein,
Richard Leys,
Forest Martinez-Mckinney,
Jessica Metcalfe,
Zachary Metzler,
John W. Mitchell,
Norito Nakano,
Jennifer Ott
, et al. (11 additional authors not shown)
Abstract:
A next-generation medium-energy gamma-ray telescope targeting the MeV range would address open questions in astrophysics regarding how extreme conditions accelerate cosmic-ray particles, produce relativistic jet outflows, and more. One concept, AMEGO-X, relies upon the mission-enabling CMOS Monolithic Active Pixel Sensor silicon chip AstroPix. AstroPix is designed for space-based use, featuring lo…
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A next-generation medium-energy gamma-ray telescope targeting the MeV range would address open questions in astrophysics regarding how extreme conditions accelerate cosmic-ray particles, produce relativistic jet outflows, and more. One concept, AMEGO-X, relies upon the mission-enabling CMOS Monolithic Active Pixel Sensor silicon chip AstroPix. AstroPix is designed for space-based use, featuring low noise, low power consumption, and high scalability. Desired performance of the device include an energy resolution of 5 keV (or 10% FWHM) at 122 keV and a dynamic range per-pixel of 25-700 keV, enabled by the addition of a high-voltage bias to each pixel which supports a depletion depth of 500 um. This work reports on the status of the AstroPix development process with emphasis on the current version under test, version three (v3), and highlights of version two (v2). Version 3 achieves energy resolution of 10.4 +\- 3.2 % at 59.5 keV and 94 +\- 6 um depletion in a low-resistivity test silicon substrate.
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Submitted 20 January, 2025;
originally announced January 2025.
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ComPair-2: A Next Generation Medium Energy Gamma-ray Telescope Prototype
Authors:
Regina Caputo,
Carolyn Kierans,
Nicholas Cannady,
Abe Falcone,
Yasushi Fukazawa,
Manoj Jadhav,
Matthew Kerr,
Nicholas Kirschner,
Kavic Kumar,
Adrien Laviron,
Richard Leys,
Iker Liceaga-Indart,
Julie McEnery,
Jessica Metcalfe,
Zachary Metzler,
Nathan Miller,
John Mitchell,
Lucas Parker,
Ivan Peric,
Jeremy Perkins,
Bernard Phlips,
Judith Racusin,
Makoto Sasaki,
Kenneth N. Segal,
Daniel Shy
, et al. (8 additional authors not shown)
Abstract:
Many questions posed in the Astro2020 Decadal survey in both the New Messengers and New Physics and the Cosmic Ecosystems science themes require a gamma-ray mission with capabilities exceeding those of existing (e.g. Fermi, Swift) and planned (e.g. COSI) observatories. ComPair, the Compton Pair telescope, is a prototype of such a next-generation gamma-ray mission. It had its inaugural balloon flig…
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Many questions posed in the Astro2020 Decadal survey in both the New Messengers and New Physics and the Cosmic Ecosystems science themes require a gamma-ray mission with capabilities exceeding those of existing (e.g. Fermi, Swift) and planned (e.g. COSI) observatories. ComPair, the Compton Pair telescope, is a prototype of such a next-generation gamma-ray mission. It had its inaugural balloon flight from Ft. Sumner, New Mexico in August 2023. To continue the goals of the ComPair project to develop technologies that will enable a future gamma-ray mission, the next generation of ComPair (ComPair-2) will be upgraded to increase the sensitivity and low-energy transient capabilities of the instrument. These advancements are enabled by AstroPix, a silicon monolithic active pixel sensor, in the tracker and custom dual-gain silicon photomultipliers and front-end electronics in the calorimeter. This effort builds on design work for the All-sky Medium Energy Gamma-ray Observatory eXplorer (AMEGO-X) concept that was submitted the 2021 MIDEX Announcement of Opportunity. Here we describe the ComPair-2 prototype design and integration and testing plans to advance the readiness level of these novel technologies.
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Submitted 16 December, 2024; v1 submitted 3 December, 2024;
originally announced December 2024.
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A-STEP: The AstroPix Sounding Rocket Technology Demonstration Payload
Authors:
Daniel P. Violette,
Amanda Steinhebel,
Abhradeep Roy,
Ryan Boggs,
Regina Caputo,
David Durachka,
Yasushi Fukazawa,
Masaki Hashizume,
Scott Hesh,
Manoj Jadhav,
Carolyn Kierans,
Kavic Kumar,
Shin Kushima,
Richard Leys,
Jessica Metcalfe,
Zachary Metzler,
Norito Nakano,
Ivan Peric,
Jeremy Perkins,
Lindsey Seo,
K. W. Taylor Shin,
Nicolas Striebig,
Yusuke Suda,
Hiroyasu Tajima
Abstract:
A next-generation medium-energy (100 keV to 100 MeV) gamma-ray observatory will greatly enhance the identification and characterization of multimessenger sources in the coming decade. Coupling gamma-ray spectroscopy, imaging, and polarization to neutrino and gravitational wave detections will develop our understanding of various astrophysical phenomena including compact object mergers, supernovae…
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A next-generation medium-energy (100 keV to 100 MeV) gamma-ray observatory will greatly enhance the identification and characterization of multimessenger sources in the coming decade. Coupling gamma-ray spectroscopy, imaging, and polarization to neutrino and gravitational wave detections will develop our understanding of various astrophysical phenomena including compact object mergers, supernovae remnants, active galactic nuclei and gamma-ray bursts. An observatory operating in the MeV energy regime requires technologies that are capable of measuring Compton scattered photons and photons interacting via pair production. AstroPix is a monolithic high voltage CMOS active pixel sensor which enables future gamma-ray telescopes in this energy range. AstroPix's design is iterating towards low-power (~1.5 mW/cm$^{2}$), high spatial (500 microns pixel pitch) and spectral (<5 keV at 122 keV) tracking of photon and charged particle interactions. Stacking planar arrays of AstroPix sensors in three dimensions creates an instrument capable of reconstructing the trajectories and energies of incident gamma rays over large fields of view. A prototype multi-layered AstroPix instrument, called the AstroPix Sounding rocket Technology dEmonstration Payload (A-STEP), will test three layers of AstroPix quad chips in a suborbital rocket flight. These quad chips (2x2 joined AstroPix sensors) form the 4x4 cm$^{2}$ building block of future large area AstroPix instruments, such as ComPair-2 and AMEGO-X. This payload will be the first demonstration of AstroPix detectors operated in a space environment and will demonstrate the technology's readiness for future astrophysical and nuclear physics applications. In this work, we overview the design and state of development of the ASTEP payload.
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Submitted 5 November, 2024;
originally announced November 2024.
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Tuning of Nuclear Spectroscopic Telescope Array (NuSTAR) Application Specific Integrated Circuits (ASICs) to improve low energy threshold of future Hard X-ray Imaging Detectors
Authors:
Daniel P. Violette,
Branden Allen,
Jaesub Hong,
Hiromasa Miyasaka,
Jonathan Grindlay
Abstract:
Detector commanding, processing and readout of spaceborne instrumentation is often accomplished with Application Specific Integrated Circuits (ASICs). The ASIC designed for the Nuclear Spectroscopic Telescope Array (NuSTAR) mission (NuASIC) enables future tiled CdZnTe (CZT) detector array readout for x-ray detectors such as the High Resolution Energetic X-ray Imager (HREXI). Modified NuASIC gain s…
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Detector commanding, processing and readout of spaceborne instrumentation is often accomplished with Application Specific Integrated Circuits (ASICs). The ASIC designed for the Nuclear Spectroscopic Telescope Array (NuSTAR) mission (NuASIC) enables future tiled CdZnTe (CZT) detector array readout for x-ray detectors such as the High Resolution Energetic X-ray Imager (HREXI). Modified NuASIC gain settings have been implemented for HREXI's broader targeted imaging energy range (3-300 keV) compared to NuSTAR (2-79 keV), which may require updated NuASIC internal parameters for optimal energy resolution. To reach HREXI's targeted low energy threshold, we have also enabled the NuASIC's "Charge Pump Mode" (CPM), which introduces an additional tuning parameter. In this paper, we describe the mechanics of the NuASIC's adjustable parameters and use our recently developed ASIC Test Stand (ATS) to probe a "bare" NuASIC using its internal test pulser. We record the effects of parameter tuning on the device's electronics noise and low energy threshold and report the optimal set of parameters for HREXI's updated gain setting. We detail a semi-automated procedure to derive the optimal parameters for each of HREXI's large area, closely tiled NuASIC/CZT detectors to expedite instrument integration.
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Submitted 17 August, 2023;
originally announced August 2023.
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Imaging effects due to pixel distortions in CdZnTe (CZT) detectors -- results from the HREXI Calibration Facility (HCF)
Authors:
Arkadip Basak,
Branden Allen,
Jaesub Hong,
Daniel P. Violette,
Jonathan Grindlay
Abstract:
ProtoEXIST2 (P2) was a prototype imaging X-ray detector plane developed for wide-field Time Domain Astrophysics (TDA) in the 5 - 200 keV energy band. It was composed of an 8 $\times$ 8 array of 5 mm thick, 2cm $\times$ 2cm pixelated (32 $\times$ 32) CdZnTe (CZT) detectors with a 0.6 mm pitch that utilize the NuSTAR ASIC(NuASIC) for readout. During the initial detector development process leading u…
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ProtoEXIST2 (P2) was a prototype imaging X-ray detector plane developed for wide-field Time Domain Astrophysics (TDA) in the 5 - 200 keV energy band. It was composed of an 8 $\times$ 8 array of 5 mm thick, 2cm $\times$ 2cm pixelated (32 $\times$ 32) CdZnTe (CZT) detectors with a 0.6 mm pitch that utilize the NuSTAR ASIC(NuASIC) for readout. During the initial detector development process leading up to post-flight examination of the entire detector plane, distortions in expected pixel positions and shapes were observed in a significant fraction of the detectors. The HREXI (High Resolution Energetic X-ray Imager) Calibration Facility (HCF) was designed and commissioned to improve upon these early experiments and to rapidly map out and characterize pixel non-uniformities and defects within CZT detector planes at resolutions down to 50 $\rm μ$m. Using this facility, the sub-pixel level detector response of P2 was measured at 100 $\rm μ$m resolution and analyzed to extract and evaluate the area and profile of individual pixels, their morphology across the entire P2 detector plane for comparison with previous measurements and to provide additional characterization. In this article, we evaluate the imaging performance of a coded-aperture telescope using the observed pixel morphology for P2 detectors. This investigation will serve as an initial guide for detector selection in the development of HREXI detector planes, for the future implementation of the 4pi X-Ray Imaging Observatory (4piXIO) mission which aims to provide simultaneous and continuous imaging of the full sky ($\rm 4π$ sr) in the 3-200 keV energy band with $\rm \simeq$ 2 arcmin angular resolution and $\simeq$ 10 arcsec source localization, as well as other, future coded-aperture instruments.
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Submitted 17 March, 2023;
originally announced March 2023.
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Testing Station for Fast Screening of Through Silicon Via (TSV)-enabled Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors
Authors:
Daniel P. Violette,
Branden Allen,
Jaesub Hong,
Hiromasa Miyasaka,
Jonathan Grindlay
Abstract:
Application Specific Integrated Circuits (ASICs) are used in space-borne instruments for signal processing and detector readout. The electrical interface of these ASICs to frontend printed circuit boards (PCBs) is commonly accomplished with wire bonds. Through Silicon Via (TSV) technology has been proposed as an alternative interconnect technique that will reduce assembly complexity of ASIC packag…
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Application Specific Integrated Circuits (ASICs) are used in space-borne instruments for signal processing and detector readout. The electrical interface of these ASICs to frontend printed circuit boards (PCBs) is commonly accomplished with wire bonds. Through Silicon Via (TSV) technology has been proposed as an alternative interconnect technique that will reduce assembly complexity of ASIC packaging by replacing wire bonding with flip-chip bonding. TSV technology is advantageous in large detector arrays where TSVs enable close detector tiling on all sides. Wafer-level probe card testing of TSV ASICs is frustrated by solder balls introduced onto the ASIC surface for flip-chip bonding that hamper alignment. Therefore, we developed the ASIC Test Stand (ATS) to enable rapid screening and characterization of individual ASIC die. We successfully demonstrated ATS operation on ASICs originally developed for CdZnTe detectors on the Nuclear Spectroscopic and Telescope Array (NuSTAR) mission that were later modified with TSVs in a via-last process. We tested both back-side blind-TSVs and front-side through-TSVs, with results from internal test pulser measurements that demonstrate performance equal to or exceeding the probe card wafer-level testing data. The ATS can easily be expanded or duplicated in order to parallelize ASIC screening for large area imaging detectors of future space programs.
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Submitted 6 April, 2022; v1 submitted 4 April, 2022;
originally announced April 2022.
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Proof of Concept for Through Silicon Vias (TSVs) in Application Specific Integrated Circuits (ASICs) for Hard X-ray Imaging Detectors
Authors:
Jaesub Hong,
Jonathan Grindlay,
Branden Allen,
Daniel P. Violette,
Hiromasa Miyasaka,
Dean Malta,
Jennifer Ovental,
David Bordelon,
Daniel Richter
Abstract:
Application Specific Integrated Circuits (ASICs) are commonly used to efficiently process the signals from sensors and detectors in space. Wire bonding is a space qualified technique of making interconnections between ASICs and their substrate packaging board for power, control and readout of the ASICs. Wire bonding is nearly ubiquitous in modern space programs, but their exposed wires can be pron…
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Application Specific Integrated Circuits (ASICs) are commonly used to efficiently process the signals from sensors and detectors in space. Wire bonding is a space qualified technique of making interconnections between ASICs and their substrate packaging board for power, control and readout of the ASICs. Wire bonding is nearly ubiquitous in modern space programs, but their exposed wires can be prone to damage during assembly and subject to electric interference during operations. Additional space around the ASICs needed for wire bonding also impedes efficient packaging of large arrays of detectors. Here we introduce the Through Silicon Vias (TSV) technology that replaces wire bonds and eliminates their shortcomings. We have successfully demonstrated the feasibility of implementing TSVs to existing ASIC wafers (a.k.a. a via-last process) developed for processing the X-ray signals from the X-ray imaging CdZnTe detectors on the Nuclear Spectroscopic Telescope Array (NuSTAR) Small Explorer mission that was launched in 2012. While TSVs are common in the semiconductor industry, this is the first (to our knowledge) successful application for Astrophysics imaging instrumentation. We expect that the TSV technology will simplify the detector assembly, and thus will enable significant cost and schedule savings in assembly of large area CdZnTe detectors.
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Submitted 15 March, 2021;
originally announced March 2021.
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HCF (HREXI Calibration Facility): Mapping out sub-pixel level responses from high resolution Cadmium Zinc Telluride (CZT) imaging X-ray detectors
Authors:
Arkadip Basak,
Branden Allen,
Jaesub Hong,
Daniel P. Violette,
Jonathan Grindlay
Abstract:
The High Resolution Energetic X-Ray Imager (HREXI) CZT detector development program at Harvard is aimed at developing tiled arrays of finely pixelated CZT detectors for use in wide-field coded aperture 3-200 keV X-ray telescopes. A pixel size of $\simeq$ 600 $μm$ has already been achieved in the ProtoEXIST2 (P2) detector plane with CZT read out by the NuSTAR ASIC. This paves the way for even small…
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The High Resolution Energetic X-Ray Imager (HREXI) CZT detector development program at Harvard is aimed at developing tiled arrays of finely pixelated CZT detectors for use in wide-field coded aperture 3-200 keV X-ray telescopes. A pixel size of $\simeq$ 600 $μm$ has already been achieved in the ProtoEXIST2 (P2) detector plane with CZT read out by the NuSTAR ASIC. This paves the way for even smaller 300 $μm$ pixels in the next generation HREXI detectors. This article describes a new HREXI calibration facility (HCF) which enables a high resolution sub-pixel level (100 $μm$) 2D scan of a 256 $cm^2$ tiled array of 2 $\times$ 2 cm CZT detectors illuminated by a bright X-ray AmpTek Mini-X tube source at timescales of around a day. HCF is a significant improvement from the previous apparatus used for scanning these detectors which took $\simeq$ 3 weeks to complete a 1D scan of a similar detector plane. Moreover, HCF has the capability to scan a large tiled array of CZT detectors ($32cm \times 32cm$) at 100 $μm$ resolution in the 10 - 50 keV energy range which was not possible previously. This paper describes the design, construction, and implementation of HCF for the calibration of the P2 detector plane.
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Submitted 8 April, 2020;
originally announced April 2020.
