A multi-channel silicon package for large-scale skipper-CCD experiments
Authors:
A. M. Botti,
C. Chavez,
M. Sofo-Haro,
C. S. Miller,
F. Chierchie,
M. Jonas,
M. Lisovenko,
H. Gutti,
D. Czaplewski,
A. Lathrop,
J. Tiffenberg,
G. Fernandez-Moroni,
J. Estrada
Abstract:
The next generation of experiments for rare-event searches based on skipper Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor packaging and readout. Scaling the active mass and simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel high-density silicon-based package that must be massively produced and tested. In this work, we present…
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The next generation of experiments for rare-event searches based on skipper Charge Coupled Devices (skipper-CCDs) presents new challenges for the sensor packaging and readout. Scaling the active mass and simultaneously reducing the experimental backgrounds in orders of magnitude requires a novel high-density silicon-based package that must be massively produced and tested. In this work, we present the design, fabrication, testing, and empirical signal model of a multi-channel silicon package. In addition, we outline the chosen specifications for the ongoing production of 1500 wafers that will add up to a 10 kg skipper-CCD array with 24000 readout channels.
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Submitted 12 January, 2025; v1 submitted 8 October, 2024;
originally announced October 2024.