Showing 1–13 of 13 results for author: Suljic, M

Further Characterisation of Digital Pixel Test Structures Implemented in a 65 nm CMOS Process

Authors: Gianluca Aglieri Rinella, Nicole Apadula, Anton Andronic, Matias Antonelli, Mauro Aresti, Roberto Baccomi, Pascal Becht, Stefania Beole, Marcello Borri, Justus Braach, Matthew Daniel Buckland, Eric Buschmann, Paolo Camerini, Francesca Carnesecchi, Leonardo Cecconi, Edoardo Charbon, Giacomo Contin, Dominik Dannheim, Joao de Melo, Wenjing Deng, Antonello di Mauro, Jan Hasenbichler, Hartmut Hillemanns, Geun Hee Hong, Artem Isakov , et al. (33 additional authors not shown)

Abstract: The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at 0.07% X/X$_{0}$ per layer and have a low power consumption of 40 mW/cm$^{2}$ by implementing wafer-scale MAPS bent into cylindrical half layers. To address these challenging requirements, the ALICE ITS3 project, in conj… ▽ More The next generation of MAPS for future tracking detectors will have to meet stringent requirements placed on them. One such detector is the ALICE ITS3 that aims to be very light at 0.07% X/X$_{0}$ per layer and have a low power consumption of 40 mW/cm$^{2}$ by implementing wafer-scale MAPS bent into cylindrical half layers. To address these challenging requirements, the ALICE ITS3 project, in conjunction with the CERN EP R&D on monolithic pixel sensors, proposed the Tower Partners Semiconductor Co. 65 nm CMOS process as the starting point for the sensor. After the initial results confirmed the detection efficiency and radiation hardness, the choice of the technology was solidified by demonstrating the feasibility of operating MAPS in low-power consumption regimes, < 50 mW/cm$^{2}$, while maintaining high-quality performance. This was shown through a detailed characterisation of the Digital Pixel Test Structure (DPTS) prototype exposed to X-rays and ionising beams, and the results are presented in this article. Additionally, the sensor was further investigated through studies of the fake-hit rate, the linearity of the front-end in the range 1.7-28 keV, the performance after ionising irradiation, and the detection efficiency of inclined tracks in the range 0-45$^\circ$. △ Less

Submitted 9 May, 2025; originally announced May 2025.

Detection efficiency and spatial resolution of Monolithic Active Pixel Sensors bent to different radii

Authors: Anton Andronic, Pascal Becht, Mihail Bogdan Blidaru, Giuseppe Eugenio Bruno, Francesca Carnesecchi, Emma Chizzali, Domenico Colella, Manuel Colocci, Giacomo Contin, Laura Fabbietti, Roman Gernhäuser, Hartmut Hillemanns, Nicolo Jacazio, Alexander Philipp Kalweit, Alex Kluge, Artem Kotliarov, Filip Křížek, Lukas Lautner, Magnus Mager, Paolo Martinengo, Silvia Masciocchi, Marius Wilm Menzel, Alice Mulliri, Felix Reidt, Riccardo Ricci , et al. (15 additional authors not shown)

Abstract: Bent monolithic active pixel sensors are the basis for the planned fully cylindrical ultra low material budget tracking detector ITS3 of the ALICE experiment. This paper presents results from testbeam campaigns using high-energy particles to verify the performance of 50 um thick bent ALPIDE chips in terms of efficiency and spatial resolution. The sensors were bent to radii of 18, 24 and 30 mm, sli… ▽ More Bent monolithic active pixel sensors are the basis for the planned fully cylindrical ultra low material budget tracking detector ITS3 of the ALICE experiment. This paper presents results from testbeam campaigns using high-energy particles to verify the performance of 50 um thick bent ALPIDE chips in terms of efficiency and spatial resolution. The sensors were bent to radii of 18, 24 and 30 mm, slightly smaller than the foreseen bending radii of the future ALICE ITS3 layers. An efficiency larger than $99.9\%$ and a spatial resolution of approximately 5 um, in line with the nominal operation of flat ALPIDE sensors, is obtained at nominal operating conditions. These values are found to be independent of the bending radius and thus constitute an additional milestone in the demonstration of the feasibility of the planned ITS3 detector. In addition, a special geometry in which the beam particles graze the chip and traverse it laterally over distances of up to 3 mm is investigated. △ Less

Submitted 7 February, 2025; originally announced February 2025.

Performance studies of the CE-65v2 MAPS prototype structure

Authors: A. Ilg, A. Lorenzetti, H. Baba, J. Baudot, A. Besson, S. Bugiel, T. Chujo, C. Colledani, A. Dorokhov, Z. El Bitar, M. Goffe, T. Gunji, C. Hu-Guo, K. Jaaskelainen, T. Katsuno, A. Kluge, A. Kostina, A. Kumar, A. Macchiolo, M. Mager, J. Park, E. Ploerer, S. Sakai, S. Senyukov, H. Shamas , et al. (8 additional authors not shown)

Abstract: With the next upgrade of the ALICE inner tracking system (ITS3) as its primary focus, a set of small MAPS test structures have been developed in the 65 nm TPSCo CMOS process. The CE-65 focuses on the characterisation of the analogue charge collection properties of this technology. The latest iteration, the CE-65v2, was produced in different processes (standard, with a low-dose n-type blanket, and… ▽ More With the next upgrade of the ALICE inner tracking system (ITS3) as its primary focus, a set of small MAPS test structures have been developed in the 65 nm TPSCo CMOS process. The CE-65 focuses on the characterisation of the analogue charge collection properties of this technology. The latest iteration, the CE-65v2, was produced in different processes (standard, with a low-dose n-type blanket, and blanket with gap between pixels), pixel pitches (15, 18, 22.5 $μ$m), and pixel arrangements (square or staggered). The comparatively large pixel array size of $48\times24$ pixels in CE-65v2 allows the uniformity of the pixel response to be studied, among other benefits. The CE-65v2 chip was characterised in a test beam at the CERN SPS. A first analysis showed that hit efficiencies of $\geq 99\%$ and spatial resolution better than 5 $μ$m can be achieved for all pitches and process variants. For the standard process, thanks to larger charge sharing, even spatial resolutions below 3 $μ$m are reached, in line with vertex detector requirements for the FCC-ee. This contribution further investigates the data collected at the SPS test beam. Thanks to the large sensor size and efficient data collection, a large amount of statistics was collected, which allows for detailed in-pixel studies to see the efficiency and spatial resolution as a function of the hit position within the pixels. Again, different pitches and process variants are compared. △ Less

Submitted 24 February, 2025; v1 submitted 6 February, 2025; originally announced February 2025.

Comments: 6 pages, 3 figures, 1 table, Pixel 2024 conference proceeding

Journal ref: 2025 JINST 20 C03033

Characterisation of analogue MAPS produced in the 65 nm TPSCo process

Authors: Eduardo Ploerer, Hitoshi Baba, Jerome Baudot, Auguste Besson, Szymon Bugiel, Tatsuya Chujo, Claude Colledani, Andrei Dorokhov, Ziad El Bitar, Mathieu Goffe, Taku Gunji, Christine Hu-Guo, Armin Ilg, Kimmo Jaaskelainen, Towa Katsuno, Alexander Kluge, Anhelina Kostina, Ajit Kumar, Alessandra Lorenzetti, Anna Macchiolo, Magnus Mager, Jonghan Park, Shingo Sakai, Serhiy Senyukov, Hasan Shamas , et al. (9 additional authors not shown)

Abstract: Within the context of the ALICE ITS3 collaboration, a set of MAPS small-scale test structures were developed using the 65 nm TPSCo CMOS imaging process with the upgrade of the ALICE inner tracking system as its primary focus. One such sensor, the Circuit Exploratoire 65 nm (CE-65), and its evolution the CE-65v2, were developed to explore charge collection properties for varying configurations incl… ▽ More Within the context of the ALICE ITS3 collaboration, a set of MAPS small-scale test structures were developed using the 65 nm TPSCo CMOS imaging process with the upgrade of the ALICE inner tracking system as its primary focus. One such sensor, the Circuit Exploratoire 65 nm (CE-65), and its evolution the CE-65v2, were developed to explore charge collection properties for varying configurations including collection layer process (standard, blanket, modified with gap), pixel pitch (15, 18, \SI{22.5}{\micro\meter}), and pixel geometry (square vs hexagonal/staggered). In this work the characterisation of the CE-65v2 chip, based on $^{55}$Fe lab measurements and test beams at CERN SPS, is presented. Matrix gain uniformity up to the $\mathcal{O}$(5\%) level was demonstrated for all considered chip configurations. The CE-65v2 chip achieves a spatial resolution of under \SI{2}{\micro\meter} during beam tests. Process modifications allowing for faster charge collection and less charge sharing result in decreased spatial resolution, but a considerably wider range of operation, with both the \SI{15}{\micro\meter} and \SI{22.5}{\micro\meter} chips achieving over 99\% efficiency up to a $\sim$180 e$^{-}$ seed threshold. The results serve to validate the 65 nm TPSCo CMOS process, as well as to motivate design choices in future particle detection experiments. △ Less

Submitted 13 November, 2024; originally announced November 2024.

Comments: 7 pages, 12 figures; Proceedings for iWoRiD 2024 (Lisbon)

Time performance of Analog Pixel Test Structures with in-chip operational amplifier implemented in 65 nm CMOS imaging process

Authors: Gianluca Aglieri Rinella, Luca Aglietta, Matias Antonelli, Francesco Barile, Franco Benotto, Stefania Maria Beolè, Elena Botta, Giuseppe Eugenio Bruno, Francesca Carnesecchi, Domenico Colella, Angelo Colelli, Giacomo Contin, Giuseppe De Robertis, Florina Dumitrache, Domenico Elia, Chiara Ferrero, Martin Fransen, Alex Kluge, Shyam Kumar, Corentin Lemoine, Francesco Licciulli, Bong-Hwi Lim, Flavio Loddo, Magnus Mager, Davide Marras , et al. (21 additional authors not shown)

Abstract: In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An Analog Pixel Test Structure (APTS) featuring fast per pixel operational-amplifier-based buffering for a small matrix of four by four pixels, with a sensor with a sm… ▽ More In the context of the CERN EP R&D on monolithic sensors and the ALICE ITS3 upgrade, the Tower Partners Semiconductor Co (TPSCo) 65 nm process has been qualified for use in high energy physics, and adopted for the ALICE ITS3 upgrade. An Analog Pixel Test Structure (APTS) featuring fast per pixel operational-amplifier-based buffering for a small matrix of four by four pixels, with a sensor with a small collection electrode and a very non-uniform electric field, was designed to allow detailed characterization of the pixel performance in this technology. Several variants of this chip with different pixel designs have been characterized with a (120 GeV/$c$) positive hadron beam. This result indicates that the APTS-OA prototype variants with the best performance achieve a time resolution of 63 ps with a detection efficiency exceeding 99% and a spatial resolution of 2 $μ$m, highlighting the potential of TPSCo 65nm CMOS imaging technology for high-energy physics and other fields requiring precise time measurement, high detection efficiency, and excellent spatial resolution. △ Less

Submitted 30 October, 2024; v1 submitted 26 July, 2024; originally announced July 2024.

Characterisation of analogue Monolithic Active Pixel Sensor test structures implemented in a 65 nm CMOS imaging process

Authors: Gianluca Aglieri Rinella, Giacomo Alocco, Matias Antonelli, Roberto Baccomi, Stefania Maria Beole, Mihail Bogdan Blidaru, Bent Benedikt Buttwill, Eric Buschmann, Paolo Camerini, Francesca Carnesecchi, Marielle Chartier, Yongjun Choi, Manuel Colocci, Giacomo Contin, Dominik Dannheim, Daniele De Gruttola, Manuel Del Rio Viera, Andrea Dubla, Antonello di Mauro, Maurice Calvin Donner, Gregor Hieronymus Eberwein, Jan Egger, Laura Fabbietti, Finn Feindt, Kunal Gautam , et al. (69 additional authors not shown)

Abstract: Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: doping levels, pixel geometries and pixel pitches (10-25… ▽ More Analogue test structures were fabricated using the Tower Partners Semiconductor Co. CMOS 65 nm ISC process. The purpose was to characterise and qualify this process and to optimise the sensor for the next generation of Monolithic Active Pixels Sensors for high-energy physics. The technology was explored in several variants which differed by: doping levels, pixel geometries and pixel pitches (10-25 $μ$m). These variants have been tested following exposure to varying levels of irradiation up to 3 MGy and $10^{16}$ 1 MeV n$_\text{eq}$ cm$^{-2}$. Here the results from prototypes that feature direct analogue output of a 4$\times$4 pixel matrix are reported, allowing the systematic and detailed study of charge collection properties. Measurements were taken both using $^{55}$Fe X-ray sources and in beam tests using minimum ionizing particles. The results not only demonstrate the feasibility of using this technology for particle detection but also serve as a reference for future applications and optimisations. △ Less

Submitted 13 March, 2024; originally announced March 2024.

A high-resolution pixel silicon Vertex Detector for open charm measurements with the \NASixtyOne spectrometer at the CERN SPS

Authors: A. Aduszkiewicz, M. Bajda, M. Baszczyk, W. Bryliński, J. Brzychczyk, M. Deveaux, P. Dorosz, S. Di Luise, G. Feofilov, M. Gazdzicki, S. Igolkin, M. Jabłoński, V. Kovalenko, M. Koziel, W. Kucewicz, D. Larsen, T. Lazareva, K. Łojek, Z. Majka, P. Martinengo, A. Merzlaya, L. Mik, R. Płaneta, P. Staszel, M. Suljic , et al. (2 additional authors not shown)

Abstract: The study of open charm meson production provides an efficient tool for the investigation of the properties of hot and dense matter formed in nucleus-nucleus collisions. The interpretation of the existing di-muon data from the CERN SPS suffers from a lack of knowledge on the mechanism and properties of the open charm particle production. Due to this, the heavy-ion programme of the \NASixtyOne expe… ▽ More The study of open charm meson production provides an efficient tool for the investigation of the properties of hot and dense matter formed in nucleus-nucleus collisions. The interpretation of the existing di-muon data from the CERN SPS suffers from a lack of knowledge on the mechanism and properties of the open charm particle production. Due to this, the heavy-ion programme of the \NASixtyOne experiment at the CERN SPS has been extended by precise measurements of charm hadrons with short lifetimes. A new Vertex Detector for measurements of the rare processes of open charm production in nucleus-nucleus collisions was designed to meet the challenges of track registration and high resolution in primary and secondary vertex reconstruction. A small-acceptance version of the vertex detector was installed in 2016 and tested with Pb+Pb collisions at 150\AGeVc. It was also operating during the physics data taking on Xe+La and Pb+Pb collisions at 150\AGeVc conducted in 2017 and 2018. This paper presents the detector design and construction, data calibration, event reconstruction, and analysis procedure. △ Less

Submitted 4 February, 2023; v1 submitted 1 February, 2023; originally announced February 2023.

Comments: 13 pages, 21 figures, Fixed Acknowledgment

Digital Pixel Test Structures implemented in a 65 nm CMOS process

Authors: Gianluca Aglieri Rinella, Anton Andronic, Matias Antonelli, Mauro Aresti, Roberto Baccomi, Pascal Becht, Stefania Beole, Justus Braach, Matthew Daniel Buckland, Eric Buschmann, Paolo Camerini, Francesca Carnesecchi, Leonardo Cecconi, Edoardo Charbon, Giacomo Contin, Dominik Dannheim, Joao de Melo, Wenjing Deng, Antonello di Mauro, Jan Hasenbichler, Hartmut Hillemanns, Geun Hee Hong, Artem Isakov, Antoine Junique, Alex Kluge , et al. (27 additional authors not shown)

Abstract: The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the… ▽ More The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the first critical steps towards the realisation of this detector is to validate the sensor technology through extensive characterisation both in the laboratory and with in-beam measurements. The Digital Pixel Test Structure (DPTS) is one of the prototypes produced in the first sensor submission in this technology and has undergone a systematic measurement campaign whose details are presented in this article. The results confirm the goals of detection efficiency and non-ionising and ionising radiation hardness up to the expected levels for ALICE ITS3 and also demonstrate operation at +20 C and a detection efficiency of 99% for a DPTS irradiated with a dose of $10^{15}$ 1 MeV n$_{\mathrm{eq}}/$cm$^2$. Furthermore, spatial, timing and energy resolutions were measured at various settings and irradiation levels. △ Less

Submitted 10 July, 2023; v1 submitted 16 December, 2022; originally announced December 2022.

Comments: v4: Corrected Table 1. v3: Implemented reviewers' comments. v2: Updated threshold calibration method. Implemented colorblind friendly color palette in all figures. Updated references

The MAPS foil

Authors: S. Beolé, F. Carnesecchi, G. Contin, R. de Oliveira, A. di Mauro, S. Ferry, H. Hillemanns, A. Junique, A. Kluge, L. Lautner, M. Mager, B. Mehl, K. Rebane, F. Reidt, I. Sanna, M. Šuljić, A. Yüncü

Abstract: We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these dev… ▽ More We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised "MAPS foil", is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working. △ Less

Submitted 19 October, 2022; v1 submitted 25 May, 2022; originally announced May 2022.

First demonstration of in-beam performance of bent Monolithic Active Pixel Sensors

Authors: ALICE ITS project, :, G. Aglieri Rinella, M. Agnello, B. Alessandro, F. Agnese, R. S. Akram, J. Alme, E. Anderssen, D. Andreou, F. Antinori, N. Apadula, P. Atkinson, R. Baccomi, A. Badalà, A. Balbino, C. Bartels, R. Barthel, F. Baruffaldi, I. Belikov, S. Beole, P. Becht, A. Bhatti, M. Bhopal, N. Bianchi , et al. (230 additional authors not shown)

Abstract: A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to ra… ▽ More A novel approach for designing the next generation of vertex detectors foresees to employ wafer-scale sensors that can be bent to truly cylindrical geometries after thinning them to thicknesses of 20-40$μ$m. To solidify this concept, the feasibility of operating bent MAPS was demonstrated using 1.5$\times$3cm ALPIDE chips. Already with their thickness of 50$μ$m, they can be successfully bent to radii of about 2cm without any signs of mechanical or electrical damage. During a subsequent characterisation using a 5.4GeV electron beam, it was further confirmed that they preserve their full electrical functionality as well as particle detection performance. In this article, the bending procedure and the setup used for characterisation are detailed. Furthermore, the analysis of the beam test, including the measurement of the detection efficiency as a function of beam position and local inclination angle, is discussed. The results show that the sensors maintain their excellent performance after bending to radii of 2cm, with detection efficiencies above 99.9% at typical operating conditions, paving the way towards a new class of detectors with unprecedented low material budget and ideal geometrical properties. △ Less

Submitted 17 August, 2021; v1 submitted 27 May, 2021; originally announced May 2021.

Charge collection properties of TowerJazz 180 nm CMOS Pixel Sensors in dependence of pixel geometries and bias parameters, studied using a dedicated test-vehicle: the Investigator chip

Authors: G. Aglieri Rinella, G. Chaosong, A. di Mauro, J. Eum, H. Hillemanns, A. Junique, M. Keil, D. Kim, H. Kim, T. Kugathasan, S. Lee, M. Mager, V. Manzari, C. A. Marin Tobon, P. Martinengo, H. Mugnier, L. Musa, F. Reidt, J. Rousset, K. Sielewicz, W. Snoeys, M. Šuljić, J. W. van Hoorne, Q. M. Waheed, P. Yang , et al. (1 additional authors not shown)

Abstract: This paper contains a compilation of parameters influencing the charge collection process extracted from a comprehensive study of partially depleted Monolithic Active Pixel Sensors with small (<25 um$^2$) collection electrodes fabricated in the TowerJazz 180 nm CMOS process. These results gave guidance for the optimisation of the diode implemented in ALPIDE, the chip used in the second generation… ▽ More This paper contains a compilation of parameters influencing the charge collection process extracted from a comprehensive study of partially depleted Monolithic Active Pixel Sensors with small (<25 um$^2$) collection electrodes fabricated in the TowerJazz 180 nm CMOS process. These results gave guidance for the optimisation of the diode implemented in ALPIDE, the chip used in the second generation Inner Tracking System of ALICE, and serve as reference for future simulation studies of similar devices. The studied parameters include: reverse substrate bias, epitaxial layer thickness, charge collection electrode size and the spacing of the electrode to surrounding in-pixel electronics. The results from pixels of 28 um pitch confirm that even in partially depleted circuits, charge collection can be fast (<10 ns), and quantify the influence of the parameters onto the signal sharing and amplitudes, highlighting the importance of a correct spacing between wells and of the impact of the reverse substrate bias. △ Less

Submitted 23 September, 2020; v1 submitted 22 September, 2020; originally announced September 2020.

EUDAQ $-$ A Data Acquisition Software Framework for Common Beam Telescopes

Authors: P. Ahlburg, S. Arfaoui, J. -H. Arling, H. Augustin, D. Barney, M. Benoit, T. Bisanz, E. Corrin, D. Cussans, D. Dannheim, J. Dreyling-Eschweiler, T. Eichhorn, A. Fiergolski, I. -M. Gregor, J. Grosse-Knetter, D. Haas, L. Huth, A. Irles, H. Jansen, J. Janssen, M. Keil, J. S. Keller, M. Kiehn, H. J. Kim, J. Kroll , et al. (32 additional authors not shown)

Abstract: EUDAQ is a generic data acquisition software developed for use in conjunction with common beam telescopes at charged particle beam lines. Providing high-precision reference tracks for performance studies of new sensors, beam telescopes are essential for the research and development towards future detectors for high-energy physics. As beam time is a highly limited resource, EUDAQ has been designed… ▽ More EUDAQ is a generic data acquisition software developed for use in conjunction with common beam telescopes at charged particle beam lines. Providing high-precision reference tracks for performance studies of new sensors, beam telescopes are essential for the research and development towards future detectors for high-energy physics. As beam time is a highly limited resource, EUDAQ has been designed with reliability and ease-of-use in mind. It enables flexible integration of different independent devices under test via their specific data acquisition systems into a top-level framework. EUDAQ controls all components globally, handles the data flow centrally and synchronises and records the data streams. Over the past decade, EUDAQ has been deployed as part of a wide range of successful test beam campaigns and detector development applications. △ Less

Submitted 18 November, 2019; v1 submitted 30 September, 2019; originally announced September 2019.

Comments: 32 pages, 11 figures

INFN What Next: Ultra-relativistic Heavy-Ion Collisions

Authors: A. Dainese, E. Scomparin, G. Usai, P. Antonioli, R. Arnaldi, A. Beraudo, E. Bruna, G. E. Bruno, S. Bufalino, P. Di Nezza, M. P. Lombardo, R. Nania, F. Noferini, C. Oppedisano, S. Piano, F. Prino, A. Rossi, M. Agnello, W. M. Alberico, B. Alessandro, A. Alici, G. Andronico, F. Antinori, S. Arcelli, A. Badala , et al. (116 additional authors not shown)

Abstract: This document was prepared by the community that is active in Italy, within INFN (Istituto Nazionale di Fisica Nucleare), in the field of ultra-relativistic heavy-ion collisions. The experimental study of the phase diagram of strongly-interacting matter and of the Quark-Gluon Plasma (QGP) deconfined state will proceed, in the next 10-15 years, along two directions: the high-energy regime at RHIC a… ▽ More This document was prepared by the community that is active in Italy, within INFN (Istituto Nazionale di Fisica Nucleare), in the field of ultra-relativistic heavy-ion collisions. The experimental study of the phase diagram of strongly-interacting matter and of the Quark-Gluon Plasma (QGP) deconfined state will proceed, in the next 10-15 years, along two directions: the high-energy regime at RHIC and at the LHC, and the low-energy regime at FAIR, NICA, SPS and RHIC. The Italian community is strongly involved in the present and future programme of the ALICE experiment, the upgrade of which will open, in the 2020s, a new phase of high-precision characterisation of the QGP properties at the LHC. As a complement of this main activity, there is a growing interest in a possible future experiment at the SPS, which would target the search for the onset of deconfinement using dimuon measurements. On a longer timescale, the community looks with interest at the ongoing studies and discussions on a possible fixed-target programme using the LHC ion beams and on the Future Circular Collider. △ Less

Submitted 12 February, 2016; originally announced February 2016.

Comments: 99 pages, 56 figures