Showing 1–11 of 11 results for author: Rencz, M

Package Hermeticity Testing with Thermal Transient Measurements

Authors: Andras Vass-Varnai, M. Rencz

Abstract: The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a cr… ▽ More The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry. △ Less

Submitted 7 May, 2008; originally announced May 2008.

Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)

Contactless Thermal Characterization of High Temperature Test Chamber

Authors: Z. Szucs, G. Bognar, Vladimir Szekely, M. Rencz

Abstract: In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue testing of different MEMS devices where the homogenous temperature distribution within the close proximity from the heating filaments is very important. Our aim was to characterize the evolving temperature distribution… ▽ More In this paper the methodology and the results of a contactless thermal characterization of a high temperature test chamber will be introduced. The test chamber is used for fatigue testing of different MEMS devices where the homogenous temperature distribution within the close proximity from the heating filaments is very important. Our aim was to characterize the evolving temperature distribution inside the test chamber. In order to achieve smaller time constant a new contactless sensor card was developed. The contactless thermal characterization method introduced in this paper enables in situ heat distribution measurement inside the test chamber during operation, with the detection of potentially uneven heat distribution. △ Less

Submitted 7 May, 2008; originally announced May 2008.

Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)

A novel method for fatigue testing of MEMS devices containing movable elements

Authors: Z. Szucs, M. Rencz

Abstract: In this paper we present an electronic circuit for position or capacitance estimation of MEMS electrostatic actuators based on a switched capacitor technique. The circuit uses a capacitive divider configuration composed by a fixed capacitor and the variable capacitance of the electrostatic actuator for generating a signal that is a function of the input voltage and capacitive ratio. The proposed… ▽ More In this paper we present an electronic circuit for position or capacitance estimation of MEMS electrostatic actuators based on a switched capacitor technique. The circuit uses a capacitive divider configuration composed by a fixed capacitor and the variable capacitance of the electrostatic actuator for generating a signal that is a function of the input voltage and capacitive ratio. The proposed circuit can be used to actuate and to sense position of an electrostatic MEMS actuator without extra sensing elements. This approach is compatible with the requirements of most analog feedback systems and the circuit topology of pulsed digital oscillators (PDO). △ Less

Submitted 21 February, 2008; originally announced February 2008.

Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)

Ni-MH battery modelling for ambient intelligence applications

Authors: D. Szente-Varga, D. Horvath, M. Rencz

Abstract: Mobile devices, like sensor networks and MEMS actuators use mobile power supplies to ensure energy for their operation. These are mostly batteries. The lifetime of the devices depends on the power consumption and on the quality and capacitance of the battery. Though the integrated circuits and their power consumption improve continually, their clock frequency also increases with the time, and th… ▽ More Mobile devices, like sensor networks and MEMS actuators use mobile power supplies to ensure energy for their operation. These are mostly batteries. The lifetime of the devices depends on the power consumption and on the quality and capacitance of the battery. Though the integrated circuits and their power consumption improve continually, their clock frequency also increases with the time, and the resultant power consumption seems not to vary, or slightly increase. On the other hand, the properties of batteries are developing much slower, necessitating the optimization of their usage on system level. △ Less

Submitted 21 February, 2008; originally announced February 2008.

Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)

Comparison of Two Low-Power Electronic Interfaces for Capacitive Mems Sensors

Authors: G. Nagy, Z. Szucs, S. Hodossy, M. Rencz, A. Poppe

Abstract: The paper discusses the importance and the issues of interfacing capacitive sensors. Two architectures applicable for interfacing capacitive sensors are presented. The first solution was designed to interface a capacitive humidity sensor designed and built for a humidity-dependent monolithic capacitor developed at Budapest University of Technology and Economics. The second case presents the poss… ▽ More The paper discusses the importance and the issues of interfacing capacitive sensors. Two architectures applicable for interfacing capacitive sensors are presented. The first solution was designed to interface a capacitive humidity sensor designed and built for a humidity-dependent monolithic capacitor developed at Budapest University of Technology and Economics. The second case presents the possible read-out solutions for a SOI-MEMS accelerometer. Both of the architectures were built and tested in a discrete implementation to qualify the methods before the integrated realization. The paper presents a detailed comparison of the two methods △ Less

Submitted 21 February, 2008; originally announced February 2008.

Comments: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)

Vibration Combined High Temperature Cycle Tests for Capacitive MEMS Accelerometers

Authors: Z. Szucs, G. Nagy, S. Hodossy, M. Rencz, A. Poppe

Abstract: In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test… ▽ More In this paper vibration combined high temperature cycle tests for packaged capacitive SOI-MEMS accelerometers are presented. The aim of these tests is to provide useful Design for Reliability information for MEMS designers. A high temperature test chamber and a chopper-stabilized read-out circuitry were designed and realized at BME - DED. Twenty thermal cycles of combined Temperature Cycle Test and Fatigue Vibration Test has been carried out on 5 samples. Statistical evaluation of the test results showed that degradation has started in 3 out of the 5 samples. △ Less

Submitted 7 January, 2008; originally announced January 2008.

Comments: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Journal ref: Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

Short time die attach characterisation of semiconductor devices

Authors: P. Szabo, M. Rencz

Abstract: Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by the quality of the die attach. Voids or delaminations in this layer may cause higher temperature elevation and thus damage or shorter lifetime. Thermal test of each device in the manufacturing process would be the best… ▽ More Thermal qualification of the die attach of semiconductor devices is a very important element in the device characterization as the temperature of the chip is strongly affected by the quality of the die attach. Voids or delaminations in this layer may cause higher temperature elevation and thus damage or shorter lifetime. Thermal test of each device in the manufacturing process would be the best solution for eliminating the devices with wrong die attach layer. In this paper we will present the short time thermal transient measurement method and the structure function evaluation through simulations and measurements for die attach characterization. We will also present a method for eliminating the very time consuming calibration process. Using the proposed methods even the in-line testing of LEDs can be accomplished. △ Less

Submitted 7 January, 2008; originally announced January 2008.

Comments: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Journal ref: Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

Authors: Gy. Bognar, V. Szekely, M. Rencz

Abstract: In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in qu… ▽ More In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack. △ Less

Submitted 21 November, 2007; originally announced November 2007.

Comments: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

Characterisation of the Etching Quality in Micro-Electro-Mechanical Systems by Thermal Transient Methodology

Authors: P. Szabo, B. Nemeth, M. Rencz, B. Courtois

Abstract: Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as consequence of the differences in their manufacturing processes e.g. different etching times. We have made simulations examining how the etching quality reflect… ▽ More Our paper presents a non-destructive thermal transient measurement method that is able to reveal differences even in the micron size range of MEMS structures. Devices of the same design can have differences in their sacrificial layers as consequence of the differences in their manufacturing processes e.g. different etching times. We have made simulations examining how the etching quality reflects in the thermal behaviour of devices. These simulations predicted change in the thermal behaviour of MEMS structures having differences in their sacrificial layers. The theory was tested with measurements of similar MEMS devices prepared with different etching times. In the measurements we used the T3Ster thermal transient tester equipment. The results show that deviations in the devices, as consequence of the different etching times, result in different temperature elevations and manifest also as shift in time in the relevant temperature transient curves. △ Less

Submitted 21 November, 2007; originally announced November 2007.

Comments: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Journal ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

Creating temperature dependent Ni-MH battery models for low power mobile devices

Authors: D. Szente-Varga, Gy. Horvath, M. Rencz

Abstract: In this paper the methodology and the results of creating temperature dependent battery models for ambient intelligence applications is presented. First the measurement technology and the model generation process is presented in details, and then the characteristic features of the models are discussed. In this paper the methodology and the results of creating temperature dependent battery models for ambient intelligence applications is presented. First the measurement technology and the model generation process is presented in details, and then the characteristic features of the models are discussed. △ Less

Submitted 12 September, 2007; originally announced September 2007.

Comments: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Journal ref: Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)

Contactless Thermal Characterization Method of PCB-s Using Different IR Sensor Arrays

Authors: G. Bognár, V. Szekely, M. Rencz

Abstract: In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation will be introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in si… ▽ More In this paper the methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation will be introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack, enabling the immediate detection of potential hot spots in the system. . The elevated temperature encountered in different packaged electronic devices, like digital processors, high power amplifier, high power switches, etc., demands the application of careful temperature-aware design methodologies and the electro-thermal simulations of PCBs. The results of different electro-thermal simulations and modeling in most of the cases give good approximating results and consider the coupled effects of the real surroundings of these cards and other dissipation elements in an operating system. However the simulation time may take hours, and different systems, different surroundings should be simulated again and again. In our expectation, by using contactless temperature measurement procedure the heat distribution and the places of high dissipation elements on an operating PCB board (PCI or AGP cards in a rack-house of a PC) can be measured and localized in a dense rack system, where only a thin measuring board can be inserted between the cards during operation. △ Less

Submitted 12 September, 2007; originally announced September 2007.

Comments: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Journal ref: Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)