Cracking in polymer substrates for flexible devices and its mitigation
Authors:
Anush Ranka,
Madhuja Layek,
Sayaka Kochiyama,
Cristina Lopez-Pernia,
Alicia M. Chandler,
Conrad A. Kocoj,
Erica Magliano,
Aldo Di Carlo,
Francesca Brunetti,
Peijun Guo,
Subra Suresh,
David C. Paine,
Haneesh Kesari,
Nitin P. Padture
Abstract:
Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack…
▽ More
Mechanical reliability plays an outsized role in determining the durability of flexible electronic devices because of the significant mechanical stresses they can experience during manufacturing and operation. These devices are typically built on sheets comprising stiff thin-film electrodes on compliant polymer substrates, and it is generally assumed that the high-toughness substrates do not crack easily. Contrary to this widespread assumption, here we reveal severe, pervasive, and extensive cracking in the polymer substrates during bending of electrode/substrate sheets, which compromises the overall mechanical integrity of the entire device. The substrate-cracking phenomenon appears to be general, and it is driven by the amplified stress intensity factor caused by the elastic mismatch at the film/substrate interface. To mitigate this substrate cracking, an interlayer-engineering approach is designed and experimentally demonstrated. This approach is generic, and it is potentially applicable to myriad flexible electronic devices that utilize stiff films on compliant substrates, for improving their durability and reliability.
△ Less
Submitted 14 April, 2025;
originally announced April 2025.
Workflows Community Summit 2024: Future Trends and Challenges in Scientific Workflows
Authors:
Rafael Ferreira da Silva,
Deborah Bard,
Kyle Chard,
Shaun de Witt,
Ian T. Foster,
Tom Gibbs,
Carole Goble,
William Godoy,
Johan Gustafsson,
Utz-Uwe Haus,
Stephen Hudson,
Shantenu Jha,
Laila Los,
Drew Paine,
Frédéric Suter,
Logan Ward,
Sean Wilkinson,
Marcos Amaris,
Yadu Babuji,
Jonathan Bader,
Riccardo Balin,
Daniel Balouek,
Sarah Beecroft,
Khalid Belhajjame,
Rajat Bhattarai
, et al. (86 additional authors not shown)
Abstract:
The Workflows Community Summit gathered 111 participants from 18 countries to discuss emerging trends and challenges in scientific workflows, focusing on six key areas: time-sensitive workflows, AI-HPC convergence, multi-facility workflows, heterogeneous HPC environments, user experience, and FAIR computational workflows. The integration of AI and exascale computing has revolutionized scientific w…
▽ More
The Workflows Community Summit gathered 111 participants from 18 countries to discuss emerging trends and challenges in scientific workflows, focusing on six key areas: time-sensitive workflows, AI-HPC convergence, multi-facility workflows, heterogeneous HPC environments, user experience, and FAIR computational workflows. The integration of AI and exascale computing has revolutionized scientific workflows, enabling higher-fidelity models and complex, time-sensitive processes, while introducing challenges in managing heterogeneous environments and multi-facility data dependencies. The rise of large language models is driving computational demands to zettaflop scales, necessitating modular, adaptable systems and cloud-service models to optimize resource utilization and ensure reproducibility. Multi-facility workflows present challenges in data movement, curation, and overcoming institutional silos, while diverse hardware architectures require integrating workflow considerations into early system design and developing standardized resource management tools. The summit emphasized improving user experience in workflow systems and ensuring FAIR workflows to enhance collaboration and accelerate scientific discovery. Key recommendations include developing standardized metrics for time-sensitive workflows, creating frameworks for cloud-HPC integration, implementing distributed-by-design workflow modeling, establishing multi-facility authentication protocols, and accelerating AI integration in HPC workflow management. The summit also called for comprehensive workflow benchmarks, workflow-specific UX principles, and a FAIR workflow maturity model, highlighting the need for continued collaboration in addressing the complex challenges posed by the convergence of AI, HPC, and multi-facility research environments.
△ Less
Submitted 18 October, 2024;
originally announced October 2024.
