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TA-LRW: A Replacement Policy for Error Rate Reduction in STT-MRAM Caches
Authors:
Elham Cheshmikhani,
Hamed Farbeh,
Seyed Ghassem Miremadi,
Hossein Asadi
Abstract:
As technology process node scales down, on-chip SRAM caches lose their efficiency because of their low scalability, high leakage power, and increasing rate of soft errors. Among emerging memory technologies, Spin-Transfer Torque Magnetic RAM (STT-MRAM) is known as the most promising replacement for SRAM-based cache memories. The main advantages of STT-MRAM are its non-volatility, near-zero leakage…
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As technology process node scales down, on-chip SRAM caches lose their efficiency because of their low scalability, high leakage power, and increasing rate of soft errors. Among emerging memory technologies, Spin-Transfer Torque Magnetic RAM (STT-MRAM) is known as the most promising replacement for SRAM-based cache memories. The main advantages of STT-MRAM are its non-volatility, near-zero leakage power, higher density, soft-error immunity, and higher scalability. Despite these advantages, the high error rate in STT-MRAM cells due to retention failure, write failure, and read disturbance threatens the reliability of cache memories built upon STT-MRAM technology. The error rate is significantly increased in higher temperatures, which further affects the reliability of STT-MRAM-based cache memories. The major source of heat generation and temperature increase in STT-MRAM cache memories is write operations, which are managed by cache replacement policy. In this paper, we first analyze the cache behavior in the conventional LRU replacement policy and demonstrate that the majority of consecutive write operations (more than 66%) are committed to adjacent cache blocks. These adjacent write operations cause accumulated heat and increased temperature, which significantly increases the cache error rate. To eliminate heat accumulation and the adjacency of consecutive writes, we propose a cache replacement policy, named Thermal-Aware Least-Recently Written (TA-LRW), to smoothly distribute the generated heat by conducting consecutive write operations in distant cache blocks. TA-LRW guarantees the distance of at least three blocks for each two consecutive write operations in an 8-way associative cache. This distant write scheme reduces the temperature-induced error rate by 94.8%, on average, compared with the conventional LRU policy, which results in 6.9x reduction in cache error rate.
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Submitted 12 January, 2022;
originally announced January 2022.
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Enhancing Temporal Logic Falsification with Specification Transformation and Valued Booleans
Authors:
Johan Lidén Eddeland,
Koen Claessen,
Nicholas Smallbone,
Zahra Ramezani,
Sajed Miremadi,
Knut Åkesson
Abstract:
Cyber-Physical Systems (CPSs) are systems with both physical and software components, for example cars and industrial robots. Since these systems exhibit both discrete and continuous dynamics, they are complex and it is thus difficult to verify that they behave as expected. Falsification of temporal logic properties is an approach to find counterexamples to CPSs by means of simulation. In this pap…
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Cyber-Physical Systems (CPSs) are systems with both physical and software components, for example cars and industrial robots. Since these systems exhibit both discrete and continuous dynamics, they are complex and it is thus difficult to verify that they behave as expected. Falsification of temporal logic properties is an approach to find counterexamples to CPSs by means of simulation. In this paper, we propose two additions to enhance the capability of falsification and make it more viable in a large-scale industrial setting. The first addition is a framework for transforming specifications from a signal-based model into Signal Temporal Logic. The second addition is the use of Valued Booleans and an additive robust semantics in the falsification process. We evaluate the performance of the additive robust semantics on a set of benchmark models, and we can see that which semantics are preferable depend both on the model and on the specification.
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Submitted 18 October, 2019;
originally announced October 2019.
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3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs
Authors:
Reza Mirosanlou,
Mohammadkazem Taram,
Zahra Shirmohammadi,
Seyed-Ghassem Miremadi
Abstract:
Three Dimensional Integrated Circuits (3D IC) offer lower power consumption, higher performance, higher bandwidth, and scalability over the conventional two dimensional ICs. Through-Silicon Via (TSV) is one of the fabrication mechanisms that connects stacked dies to each other. The large size of TSVs and the proximity between them lead to undesirable coupling capacitance. This interference causes…
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Three Dimensional Integrated Circuits (3D IC) offer lower power consumption, higher performance, higher bandwidth, and scalability over the conventional two dimensional ICs. Through-Silicon Via (TSV) is one of the fabrication mechanisms that connects stacked dies to each other. The large size of TSVs and the proximity between them lead to undesirable coupling capacitance. This interference causes mutual influences between adjacent TSVs and produces crosstalk noise. Furthermore, this effect threats the reliability of data during traversal between layers. This paper proposes a mechanism that efficiently reduces crosstalk noise between TSVs with lower area overhead as compared to previous works. This mechanism revolves around the fact that retaining TSV value in current state can reduce coupling in some cases. To evaluate the mechanism, gem5 simulator is used for data extraction and several benchmarks are taken from the SPEC2006 suite. The simulation results show that the proposed mechanism reduces crosstalk noise with only 30% imposed TSV overhead while delay decreased up to 25.7% as compared to a recent related work.
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Submitted 2 January, 2019;
originally announced January 2019.
