Understanding Memristive Behavior: An Atomistic Study of the Influence of Grain Boundaries on Surface and Out-of-Plane Diffusion of Metallic Atoms
Authors:
Mohit D. Ganeriwala,
Daniel Luque-Jarava,
Francisco Pasadas,
Juan J. Palacios,
Francisco G. Ruiz,
Andres Godoy,
Enrique G. Marin
Abstract:
Atomic migration from metallic contacts, and subsequent filament formation, is recognised as a prevailing mechanism leading to resistive switching in memristors based on two-dimensional materials (2DMs). This study presents a detailed atomistic examination of the migration of different metal atoms across the grain boundaries (GBs) of 2DMs, employing Density Functional Theory in conjunction with No…
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Atomic migration from metallic contacts, and subsequent filament formation, is recognised as a prevailing mechanism leading to resistive switching in memristors based on two-dimensional materials (2DMs). This study presents a detailed atomistic examination of the migration of different metal atoms across the grain boundaries (GBs) of 2DMs, employing Density Functional Theory in conjunction with Non-Equilibrium Green's Function transport simulations. Various types of metallic atoms, Au, Cu, Al, Ni, and Ag, are examined, focusing on their migration both in the out-of-plane direction through a MoS\textsubscript{2} layer and along the surface of the MoS\textsubscript{2} layer, pertinent to filament formation in vertical and lateral memristors, respectively. Different types of GBs usually present in MoS\textsubscript{2} are considered to assess their influence on the diffusion of metal atoms. The findings are compared with structures based on pristine MoS\textsubscript{2} and those with mono-sulfur vacancies, aiming to understand the key elements that affect the switching performance of memristors. Furthermore, transport simulations are carried out to evaluate the effects of GBs on both out-of-plane and in-plane electron conductance, providing valuable insights into the resistive switching ratio.
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Submitted 1 January, 2025;
originally announced January 2025.
