Showing 1–2 of 2 results for author: Katona, G L
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Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu-Sn bilayers at room temperature
Authors:
H. Zaka,
S. S. Shenouda,
S. S. Fouad,
M. Medhat,
G. L. Katona,
A. Csik,
G. A. Langer,
D. L. Beke
Abstract:
Solid state reaction between nanocrystalline Cu and Sn films was investigated at room temperature by depth profiling with secondary neutral mass spectrometry and by X-ray diffraction. A rapid diffusion intermixing was observed leading to the formation of homogeneous Cu 6Sn5 layer. There is no indication of the appearance of the Cu3Sn phase. This offers a way for solid phase soldering at low temper…
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Solid state reaction between nanocrystalline Cu and Sn films was investigated at room temperature by depth profiling with secondary neutral mass spectrometry and by X-ray diffraction. A rapid diffusion intermixing was observed leading to the formation of homogeneous Cu 6Sn5 layer. There is no indication of the appearance of the Cu3Sn phase. This offers a way for solid phase soldering at low temperatures, i.e. to produce homogeneous Cu6Sn5 intermediate layer of several tens of nanometers during reasonable time (in the order of hours or less). From the detailed analysis of the growth of the planar reaction layer, formed at the initial interface in Sn(100 nm)/Cu(50 nm) system, the value of the parabolic growth rate coefficient at room temperature is 2.3 x 10-15 cm2/s. In addition, the overall increase of the composition near to the substrate inside the Cu film was interpreted by grain boundary diffusion induced solid state reaction: the new phase formed along the grain boundaries and grew perpendicular to the boundary planes. From the initial slope of the composition versus time function, the interface velocity during this reaction was estimated to be about 0.5 nm/h.
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Submitted 6 January, 2017;
originally announced January 2017.
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Reverse depth profiling of electrodeposited Co/Cu multilayers by SNMS
Authors:
A. Csik,
K. Vad,
G. A. Langer,
G. L. Katona,
E. Toth-Kadar,
L. Peter
Abstract:
The overall quality of multilayer thin films prepared by electrodeposition is strongly influenced by the surface and interface roughness which increases with the layer number. For that very reason the reliable analysis of the first few layers can be necessary. However, in depth profiling methods based on sputtering techniques the first layer is always found at the bottom of the sputtered crater.…
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The overall quality of multilayer thin films prepared by electrodeposition is strongly influenced by the surface and interface roughness which increases with the layer number. For that very reason the reliable analysis of the first few layers can be necessary. However, in depth profiling methods based on sputtering techniques the first layer is always found at the bottom of the sputtered crater. Since the depth resolution decreases during sputtering, the analysis of the first few layers are difficult. In order to circumvent this problem, we used reverse Secondary Neutral Mass Spectrometry (SNMS) depth profiling method for electrodeposited multilayered films. We prepared thin film samples in two ways. First, Co/Cu multilayer stacks were electrodeposited on Si/Cr/Cu substrates and SNMS depth profiling was carried out from the direction of the topmost layer. Secondly, elecrodeposited Co/Cu multilayer stacks were coated with a few microns thick Ni layer and detached from the Si substrate in order to study the film structure from the side of the substrate. Using this latter method, we were able to analyze the first and, probably, the most even layers of the thin film structure with high resolution.
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Submitted 10 February, 2009;
originally announced February 2009.