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Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal experimental design
Authors:
Clay Klein,
Nicholas W. Jenkins,
Yunzhe Shao,
Yunhao Li,
Seungbeom Park,
Wookrae Kim,
Henry C. Kapteyn,
Margaret M. Murnane
Abstract:
Extreme ultraviolet (EUV) scatterometry is an increasingly important metrology that can measure critical parameters of periodic nanostructured materials in a fast, accurate, and repeatable manner and with high sensitivity to nanoscale structure and material composition. Because of this, EUV scatterometry could support manufacturing of semiconductor devices or polymer metamaterials, addressing the…
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Extreme ultraviolet (EUV) scatterometry is an increasingly important metrology that can measure critical parameters of periodic nanostructured materials in a fast, accurate, and repeatable manner and with high sensitivity to nanoscale structure and material composition. Because of this, EUV scatterometry could support manufacturing of semiconductor devices or polymer metamaterials, addressing the limitations of traditional imaging methods such as resolution and field of view, sample damage, throughput, or low sensitivity. Here we use EUV scatterometry to measure the profile of an industrially relevant 2D periodic interconnect structure, using $λ= 29$ nm light from a table-top high harmonic generation source. We show that EUV scatterometry is sensitive to out-of-plane features with single-nanometer sensitivity. Furthermore, we also apply a methodology based on the Fisher information matrix to optimize experimental design parameters, such as incidence angles and wavelength, to show how measurement sensitivity can be maximized. This methodology reveals the strong dependence of measurement sensitivity on both incidence angle and wavelength $-$ even in a simple two-parameter case. Through a simultaneous optimization of incidence angles and wavelength, we determine that the most sensitive measurement of the quantities of interest can be made at a wavelength of $\sim$14 nm. In the future, by reducing sample contamination due to sample preparation, deep sub-nanometer sensitivity to axial profiles and 2D structures will be possible. Our results are an important step in guiding EUV scatterometry towards increased accuracy and throughput with a priori computations and by leveraging new experimental capabilities.
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Submitted 16 April, 2025;
originally announced April 2025.
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Non-Destructive, High-Resolution, Chemically Specific, 3D Nanostructure Characterization using Phase-Sensitive EUV Imaging Reflectometry
Authors:
Michael Tanksalvala,
Christina L. Porter,
Yuka Esashi,
Bin Wang,
Nicholas W. Jenkins,
Zhe Zhang,
Galen P. Miley,
Joshua L. Knobloch,
Brendan McBennett,
Naoto Horiguchi,
Sadegh Yazdi,
Jihan Zhou,
Matthew N. Jacobs,
Charles S. Bevis,
Robert M. Karl Jr.,
Peter Johnsen,
David Ren,
Laura Waller,
Daniel E. Adams,
Seth L. Cousin,
Chen-Ting Liao,
Jianwei Miao,
Michael Gerrity,
Henry C. Kapteyn,
Margaret M. Murnane
Abstract:
Next-generation nano and quantum devices have increasingly complex 3D structure. As the dimensions of these devices shrink to the nanoscale, their performance is often governed by interface quality or precise chemical or dopant composition. Here we present the first phase-sensitive extreme ultraviolet imaging reflectometer. It combines the excellent phase stability of coherent high-harmonic source…
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Next-generation nano and quantum devices have increasingly complex 3D structure. As the dimensions of these devices shrink to the nanoscale, their performance is often governed by interface quality or precise chemical or dopant composition. Here we present the first phase-sensitive extreme ultraviolet imaging reflectometer. It combines the excellent phase stability of coherent high-harmonic sources, the unique chemical- and phase-sensitivity of extreme ultraviolet reflectometry, and state-of-the-art ptychography imaging algorithms. This tabletop microscope can non-destructively probe surface topography, layer thicknesses, and interface quality, as well as dopant concentrations and profiles. High-fidelity imaging was achieved by implementing variable-angle ptychographic imaging, by using total variation regularization to mitigate noise and artifacts in the reconstructed image, and by using a high-brightness, high-harmonic source with excellent intensity and wavefront stability. We validate our measurements through multiscale, multimodal imaging to show that this technique has unique advantages compared with other techniques based on electron and scanning-probe microscopies.
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Submitted 28 March, 2024;
originally announced April 2024.
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High-fidelity ptychographic imaging of highly periodic structures enabled by vortex high harmonic beams
Authors:
Bin Wang,
Nathan J. Brooks,
Peter C. Johnsen,
Nicholas W. Jenkins,
Yuka Esashi,
Iona Binnie,
Michael Tanksalvala,
Henry C. Kapteyn,
Margaret M. Murnane
Abstract:
Ptychographic Coherent Diffractive Imaging enables diffraction-limited imaging of nanoscale structures at extreme ultraviolet and x-ray wavelengths, where high-quality image-forming optics are not available. However, its reliance on a set of diverse diffraction patterns makes it challenging to use ptychography to image highly periodic samples, limiting its application to defect inspection for elec…
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Ptychographic Coherent Diffractive Imaging enables diffraction-limited imaging of nanoscale structures at extreme ultraviolet and x-ray wavelengths, where high-quality image-forming optics are not available. However, its reliance on a set of diverse diffraction patterns makes it challenging to use ptychography to image highly periodic samples, limiting its application to defect inspection for electronic and photonic devices. Here, we use a vortex high harmonic light beam driven by a laser carrying orbital angular momentum to implement extreme ultraviolet ptychographic imaging of highly periodic samples with high fidelity and reliability. We also demonstrate, for the first time to our knowledge, ptychographic imaging of an isolated, near-diffraction-limited defect in an otherwise periodic sample using vortex high harmonic beams. This enhanced metrology technique can enable high-fidelity imaging and inspection of highly periodic structures for next-generation nano, energy, photonic and quantum devices.
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Submitted 13 January, 2023;
originally announced January 2023.
