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Decoupling Electric Field and Temperature-Driven Atomistic Forming Mechanisms in TaOx/HfO2-Based ReRAMs using Reactive Molecular Dynamics Simulations
Authors:
Simanta Lahkar,
Valeria Bragaglia,
Behnaz Bagheri,
Donato Francesco Falcone,
Matteo Galetta,
Marilyne Sousa,
Aida Todri-Sanial
Abstract:
Resistive random access memories (ReRAMs) with a bilayer TaOx/HfO2 stack structure have shown unique multi-level resistive switching capabilities. However, the physical processes governing their behavior, and specifically the atomistic mechanisms of forming, remain poorly understood. In this work, we present a detailed analysis of the forming mechanism at the atomic level using molecular dynamics…
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Resistive random access memories (ReRAMs) with a bilayer TaOx/HfO2 stack structure have shown unique multi-level resistive switching capabilities. However, the physical processes governing their behavior, and specifically the atomistic mechanisms of forming, remain poorly understood. In this work, we present a detailed analysis of the forming mechanism at the atomic level using molecular dynamics (MD) simulations. An extended charge equilibration scheme, based on a combination of the charge transfer ionic potential (CTIP) formalism and the electrochemical dynamics with implicit degrees of freedom (EChemDID) method, is employed to model the localized effects of applied voltage. Our simulations reveal that tantalum ions exhibit the highest displacement under applied voltage, followed by hafnium ions, while oxygen ions respond only minimally. This results in the formation of a tantalum-depleted, oxygen-rich zone near the positive top electrode (anode), and the clustering of oxygen vacancies near the negative bottom electrode (cathode), where the conductive filament nucleates. This ionic segregation partially shields the bulk dielectric from the applied electric field, hindering further migration of ions in the vertical direction. We find that a minimum threshold voltage is required to initiate vacancy clustering. Filament growth proceeds through a localized mechanism, driven by thermally activated generation of oxygen vacancy defects, which are stabilized near the edge of the nucleated filament at the cathode.
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Submitted 19 June, 2025; v1 submitted 30 May, 2025;
originally announced May 2025.
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Electroforming Kinetics in HfOx/Ti RRAM: Mechanisms Behind Compositional and Thermal Engineering
Authors:
Manasa Kaniselvan,
Kevin Portner,
Donato Francesco Falcone,
Valeria Bragaglia,
Jente Clarysse,
Laura Bégon-Lours,
Marko Mladenović,
Bert J. Offrein,
Mathieu Luisier
Abstract:
A critical issue affecting filamentary resistive random access memory (RRAM) cells is the requirement of high voltages during electroforming. Reducing the magnitude of these voltages is of significant interest, as it ensures compatibility with Complementary Metal-Oxide-Semiconductor (CMOS) technologies. Previous studies have identified that changing the initial stoichiometry of the switching layer…
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A critical issue affecting filamentary resistive random access memory (RRAM) cells is the requirement of high voltages during electroforming. Reducing the magnitude of these voltages is of significant interest, as it ensures compatibility with Complementary Metal-Oxide-Semiconductor (CMOS) technologies. Previous studies have identified that changing the initial stoichiometry of the switching layer and/or implementing thermal engineering approaches has an influence over the electroforming voltage magnitude, but the exact mechanisms remain unclear. Here, we develop an understanding of how these mechanisms work within a standard a-HfO$_x$/Ti RRAM stack through combining atomistic driven-Kinetic Monte Carlo (d-KMC) simulations with experimental data. By performing device-scale simulations at atomistic resolution, we can precisely model the movements of point defects under applied biases in structurally inhomogeneous materials, which allows us to not only capture finite-size effects but also to understand how conductive filaments grow under different electroforming conditions. Doing atomistic simulations at the device-level also enables us to link simulations of the mechanisms behind conductive filament formation with trends in experimental data with the same material stack. We identify a transition from primarily vertical to lateral ion movement dominating the filamentary growth process in sub-stoichiometric oxides, and differentiate the influence of global and local heating on the morphology of the formed filaments. These different filamentary structures have implications for the dynamic range exhibited by formed devices in subsequent SET/RESET operations. Overall, our results unify the complex ion dynamics in technologically relevant HfO$_x$/Ti-based stacks, and provide guidelines that can be leveraged when fabricating devices.
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Submitted 10 May, 2025;
originally announced May 2025.
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Hardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory Tasks
Authors:
Wooseok Choi,
Thomas van Bodegraven,
Jelle Verest,
Olivier Maher,
Donato Francesco Falcone,
Antonio La Porta,
Daniel Jubin,
Bert Jan Offrein,
Siegfried Karg,
Valeria Bragaglia,
Aida Todri-Sanial
Abstract:
We demonstrate the first hardware implementation of an oscillatory neural network (ONN) utilizing resistive memory (ReRAM) for coupling elements. A ReRAM crossbar array chip, integrated into the Back End of Line (BEOL) of CMOS technology, is leveraged to establish dense coupling elements between oscillator neurons, allowing phase-encoded analog information to be processed in-memory. We also realiz…
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We demonstrate the first hardware implementation of an oscillatory neural network (ONN) utilizing resistive memory (ReRAM) for coupling elements. A ReRAM crossbar array chip, integrated into the Back End of Line (BEOL) of CMOS technology, is leveraged to establish dense coupling elements between oscillator neurons, allowing phase-encoded analog information to be processed in-memory. We also realize an ONN architecture design with the coupling ReRAM array. To validate the architecture experimentally, we present a conductive metal oxide (CMO)/HfOx ReRAM array chip integrated with a 2-by-2 ring oscillator-based network. The system successfully retrieves patterns through correct binary phase locking. This proof of concept underscores the potential of ReRAM technology for large-scale, integrated ONNs.
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Submitted 18 March, 2025;
originally announced March 2025.
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Edge Training and Inference with Analog ReRAM Technology for Hand Gesture Recognition
Authors:
Victoria Clerico,
Anirvan Dutta,
Donato Francesco Falcone,
Wooseok Choi,
Matteo Galetta,
Tommaso Stecconi,
András Horváth,
Shokoofeh Varzandeh,
Bert Jan Offrein,
Mohsen Kaboli,
Valeria Bragaglia
Abstract:
Tactile hand gesture recognition is a crucial task for user control in the automotive sector, where Human-Machine Interactions (HMI) demand low latency and high energy efficiency. This study addresses the challenges of power-constrained edge training and inference by utilizing analog Resistive Random Access Memory (ReRAM) technology in conjunction with a real tactile hand gesture dataset. By optim…
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Tactile hand gesture recognition is a crucial task for user control in the automotive sector, where Human-Machine Interactions (HMI) demand low latency and high energy efficiency. This study addresses the challenges of power-constrained edge training and inference by utilizing analog Resistive Random Access Memory (ReRAM) technology in conjunction with a real tactile hand gesture dataset. By optimizing the input space through a feature engineering strategy, we avoid relying on large-scale crossbar arrays, making the system more suitable for edge deployment. Through realistic hardware-aware simulations that account for device non-idealities derived from experimental data, we demonstrate the functionalities of our analog ReRAM-based analog in-memory computing for on-chip training, utilizing the state-of-the-art Tiki-Taka algorithm. Furthermore, we validate the classification accuracy of approximately 91.4% for post-deployment inference of hand gestures. The results highlight the potential of analog ReRAM technology and crossbar architecture with fully parallelized matrix computations for real-time HMI systems at the Edge.
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Submitted 25 February, 2025;
originally announced February 2025.
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All-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices
Authors:
Donato Francesco Falcone,
Victoria Clerico,
Wooseok Choi,
Tommaso Stecconi,
Folkert Horst,
Laura Begon-Lours,
Matteo Galetta,
Antonio La Porta,
Nikhil Garg,
Fabien Alibart,
Bert Jan Offrein,
Valeria Bragaglia
Abstract:
Analog in-memory computing is an emerging paradigm designed to efficiently accelerate deep neural network workloads. Recent advancements have focused on either inference or training acceleration. However, a unified analog in-memory technology platform-capable of on-chip training, weight retention, and long-term inference acceleration-has yet to be reported. This work presents an all-in-one analog…
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Analog in-memory computing is an emerging paradigm designed to efficiently accelerate deep neural network workloads. Recent advancements have focused on either inference or training acceleration. However, a unified analog in-memory technology platform-capable of on-chip training, weight retention, and long-term inference acceleration-has yet to be reported. This work presents an all-in-one analog AI accelerator, combining these capabilities to enable energy-efficient, continuously adaptable AI systems. The platform leverages an array of analog filamentary conductive-metal-oxide (CMO)/HfOx resistive switching memory cells (ReRAM) integrated into the back-end-of-line (BEOL). The array demonstrates reliable resistive switching with voltage amplitudes below 1.5V, compatible with advanced technology nodes. The array multi-bit capability (over 32 stable states) and low programming noise (down to 10nS) enable a nearly ideal weight transfer process, more than an order of magnitude better than other memristive technologies. Inference performance is validated through matrix-vector multiplication simulations on a 64x64 array, achieving a root-mean-square error improvement by a factor of 20 at 1 second and 3 at 10 years after programming, compared to state-of-the-art. Training accuracy closely matching the software equivalent is achieved across different datasets. The CMO/HfOx ReRAM technology lays the foundation for efficient analog systems accelerating both inference and training in deep neural networks.
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Submitted 19 June, 2025; v1 submitted 6 February, 2025;
originally announced February 2025.
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High-Conductance, Ohmic-like HfZrO$_4$ Ferroelectric Memristor
Authors:
Laura Bégon-Lours,
Mattia Halter,
Youri Popoff,
Zhenming Yu,
Donato Francesco Falcone,
Bert Jan Offrein
Abstract:
The persistent and switchable polarization of ferroelectric materials based on HfO$_2$-based ferroelectric compounds, compatible with large-scale integration, are attractive synaptic elements for neuromorphic computing. To achieve a record current density of 0.01 A/cm$^2$ (at a read voltage of 80 mV) as well as ideal memristive behavior (linear current-voltage relation and analog resistive switchi…
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The persistent and switchable polarization of ferroelectric materials based on HfO$_2$-based ferroelectric compounds, compatible with large-scale integration, are attractive synaptic elements for neuromorphic computing. To achieve a record current density of 0.01 A/cm$^2$ (at a read voltage of 80 mV) as well as ideal memristive behavior (linear current-voltage relation and analog resistive switching), devices based on an ultra-thin (2.7 nm thick), polycrystalline HfZrO$_4$ ferroelectric layer are fabricated by Atomic Layer Deposition. The use of a semiconducting oxide interlayer (WO$_{x<3}$) at one of the interfaces, induces an asymmetric energy profile upon ferroelectric polarization reversal and thus the long-term potentiation / depression (conductance increase / decrease) of interest. Moreover, it favors the stable retention of both the low and the high resistive states. Thanks to the low operating voltage (<3.5 V), programming requires less than 10${^-12}$ J for 20 ns long pulses. Remarkably, the memristors show no wake-up or fatigue effect.
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Submitted 21 September, 2023;
originally announced September 2023.