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Room-temperature Distributed Feedback CsPbBr$_3$ Perovskite Laser Integrated on a Silicon Nitride Waveguide Platform
Authors:
Federico Fabrizi,
Piotr J. Cegielski,
Saeed Goudarzi,
Naho Kurahashi,
Manuel Runkel,
Cedric Kreusel,
Bartos Chmielak,
Stephan Suckow,
Thomas Riedl,
Surendra B. Anantharaman,
Maryam Mohammadi,
Max C. Lemme
Abstract:
Silicon photonic integrated circuits (PICs) require cost-effective laser sources that can be monolithically integrated. The low cost and low-temperature solution processability of metal halide perovskites (MHPs) make them attractive alternatives to established III-V compound semiconductors for on-chip laser sources in PICs. Cesium lead bromide (CsPbBr$_3$) perovskites are emerging materials for gr…
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Silicon photonic integrated circuits (PICs) require cost-effective laser sources that can be monolithically integrated. The low cost and low-temperature solution processability of metal halide perovskites (MHPs) make them attractive alternatives to established III-V compound semiconductors for on-chip laser sources in PICs. Cesium lead bromide (CsPbBr$_3$) perovskites are emerging materials for green light-emitting diodes and lasers. To date, amplified spontaneous emission (ASE) at room temperature has been frequently achieved in CsPbBr$_3$ thin films, while reports on lasing are more limited. Here, we demonstrate a first-order grating distributed feedback (DFB) CsPbBr$_3$ thin-film laser operating at room temperature. Planar hot-pressed (PHP)-CsPbBr$_}$, with a low ASE threshold of 14.5 $μ$Jcm$^{-2}$ under 0.3 nanosecond (ns) pump pulses, was monolithically integrated into a silicon nitride (Si$_3$N$_4$) waveguide platform via a compatible top-down patterning process. The first-order grating DFB PHP-CsPbBr$_3$ thin-film laser operated at 540 nm in the green spectral region, where III-V lasers have limitations, and exhibited a lasing threshold of 0.755 mJcm$^{-2}$ at room temperature. This work marks a significant step toward utilizing MHPs for on-chip green lasers in PICs for commercial applications.
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Submitted 13 December, 2024;
originally announced December 2024.
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Integrated ultrafast all-optical polariton transistors
Authors:
Pietro Tassan,
Darius Urbonas,
Bartos Chmielak,
Jens Bolten,
Thorsten Wahlbrink,
Max C. Lemme,
Michael Forster,
Ullrich Scherf,
Rainer F. Mahrt,
Thilo Stöferle
Abstract:
The clock speed of electronic circuits has been stagnant at a few gigahertz for almost two decades because of the breakdown of Dennard scaling, which states that by shrinking the size of transistors they can operate faster while maintaining the same power consumption. Optical computing could overcome this roadblock, but the lack of materials with suitably strong nonlinear interactions needed to re…
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The clock speed of electronic circuits has been stagnant at a few gigahertz for almost two decades because of the breakdown of Dennard scaling, which states that by shrinking the size of transistors they can operate faster while maintaining the same power consumption. Optical computing could overcome this roadblock, but the lack of materials with suitably strong nonlinear interactions needed to realize all-optical switches has, so far, precluded the fabrication of scalable architectures. Recently, microcavities in the strong light-matter interaction regime enabled all-optical transistors which, when used with an embedded organic material, can operate even at room temperature with sub-picosecond switching times, down to the single-photon level. However, the vertical cavity geometry prevents complex circuits with on-chip coupled transistors. Here, by leveraging silicon photonics technology, we show exciton-polariton condensation at ambient conditions in micrometer-sized, fully integrated high-index contrast grating microcavities filled with an optically active polymer. By coupling two resonators and exploiting seeded polariton condensation, we demonstrate ultrafast all-optical transistor action and cascadability. Our experimental findings open the way for scalable, compact all-optical integrated logic circuits that could process optical signals two orders of magnitude faster than their electrical counterparts.
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Submitted 2 April, 2024;
originally announced April 2024.
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Monolithically Integrated Perovskite Semiconductor Lasers on Silicon Photonic Chips by Scalable Top-Down Fabrication
Authors:
Piotr J Cegielski,
Anna Lena Giesecke,
Stefanie Neutzner,
Caroline Porschatis,
Marina Gandini,
Daniel Schall,
Carlo AR Perini,
Jens Bolten,
Stephan Suckow,
Satender Kataria,
Bartos Chmielak,
Thorsten Wahlbrink,
Annamaria Petrozza,
Max C Lemme
Abstract:
Metal-halide perovskites are promising lasing materials for realization of monolithically integrated laser sources, the key components of silicon photonic integrated circuits (PICs). Perovskites can be deposited from solution and require only low temperature processing leading to significant cost reduction and enabling new PIC architectures compared to state-of-the-art lasers realized through cost…
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Metal-halide perovskites are promising lasing materials for realization of monolithically integrated laser sources, the key components of silicon photonic integrated circuits (PICs). Perovskites can be deposited from solution and require only low temperature processing leading to significant cost reduction and enabling new PIC architectures compared to state-of-the-art lasers realized through costly and inefficient hybrid integration of III-V semiconductors. Until now however, due to the chemical sensitivity of perovskites, no microfabrication process based on optical lithography and therefore on existing semiconductor manufacturing infrastructure has been established. Here, the first methylammonium lead iodide perovskite micro-disc lasers monolithically integrated into silicon nitride PICs by such a top-down process is presented. The lasers show a record low lasing threshold of 4.7 $μ$Jcm$^{-2}$ at room temperature for monolithically integrated lasers, which are CMOS compatible and can be integrated in the back-end-of-line (BEOL) processes.
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Submitted 18 July, 2019;
originally announced July 2019.
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Integrated perovskite lasers on silicon nitride waveguide platform by cost-effective high throughput fabrication
Authors:
Piotr Jacek Cegielski,
Stefanie Neutzner,
Caroline Porschatis,
Holger Lerch,
Jens Bolten,
Stephan Suckow,
Ajay Ram Srimath Kandada,
Bartos Chmielak,
Annamaria Petrozza,
Thorsten Wahlbrink,
Anna Lena Giesecke
Abstract:
Metal-halide perovskites are a class of solution processed materials with remarkable optoelectronic properties such as high photoluminescence quantum yields and long carrier lifetimes, which makes them promising for a wide range of efficient photonic devices. In this work, we demonstrate the first successful integration of a perovskite laser onto a silicon nitride photonic chip. High throughput, l…
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Metal-halide perovskites are a class of solution processed materials with remarkable optoelectronic properties such as high photoluminescence quantum yields and long carrier lifetimes, which makes them promising for a wide range of efficient photonic devices. In this work, we demonstrate the first successful integration of a perovskite laser onto a silicon nitride photonic chip. High throughput, low cost optical lithography is used followed by indirect structuring of the perovskite waveguide. We embed methylammonium lead tri-iodide (MAPbI3) in a pre-patterned race-track microresonator and couple the emitted light to an integrated photonic waveguide. We clearly observe the build-up of spectrally narrow lasing modes at room temperature upon a pump threshold fluence of $19.6 μJcm^{-2}$. Our results evidence the possibility of on-chip lasers based on metal-halide perovskites with industry relevance on a commercially available dielectric photonic platform, which is a step forward towards low-cost integrated photonic devices.
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Submitted 4 July, 2017;
originally announced July 2017.