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Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors
Authors:
L. Andricek,
M. Beimforde,
A. Macchiolo,
H-G. Moser,
R. Nisius,
R. H. Richter,
S. Terzo,
P. Weigell
Abstract:
The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the al…
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The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allows for stacking of different interconnected chip and sensor layers without destroying the already formed bonds. In combination with Inter-Chip-Vias (ICVs) this paves the way for vertical integration. Both technologies are combined in a pixel module concept which is the basis for the modules discussed in this paper.
Mechanical and electrical parameters of pixel modules employing both SLID interconnections and sensors of 75 micrometer thickness are covered. The mechanical features discussed include the interconnection efficiency, alignment precision and mechanical strength. The electrical properties comprise the leakage currents, tuning characteristics, charge collection, cluster sizes and hit efficiencies. Targeting at a usage at the high luminosity upgrade of the LHC accelerator called HL-LHC, the results were obtained before and after irradiation up to fluences of $10^{16}$ $\mathrm{n}_{\mathrm{eq}}/\mathrm{cm}^2$ (1 MeV neutrons).
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Submitted 29 July, 2014; v1 submitted 22 October, 2013;
originally announced October 2013.
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Planar Pixel Sensors for the ATLAS Upgrade: Beam Tests results
Authors:
J. Weingarten,
S. Altenheiner,
M. Beimforde,
M. Benoit,
M. Bomben,
G. Calderini,
C. Gallrapp,
M. George,
S. Gibson,
S. Grinstein,
Z. Janoska,
J. Jentzsch,
O. Jinnouchi,
T. Kishida,
A. La Rosa,
V. Libov,
A. Macchiolo,
G. Marchiori,
D. Münstermann,
R. Nagai,
G. Piacquadio,
B. Ristic,
I. Rubinskiy,
A. Rummler,
Y. Takubo
, et al. (6 additional authors not shown)
Abstract:
Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track incidence angle for different bulk materials. Measurements of n-in-n pixel sensors are presented as a fu…
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Results of beam tests with planar silicon pixel sensors aimed towards the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include spatial resolution, charge collection performance and charge sharing between neighbouring cells as a function of track incidence angle for different bulk materials. Measurements of n-in-n pixel sensors are presented as a function of fluence for different irradiations. Furthermore p-type silicon sensors from several vendors with slightly differing layouts were tested. All tested sensors were connected by bump-bonding to the ATLAS Pixel read-out chip. We show that both n-type and p-type tested planar sensors are able to collect significant charge even after integrated fluences expected at HL-LHC.
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Submitted 9 November, 2012; v1 submitted 5 April, 2012;
originally announced April 2012.
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Characterization of Thin Pixel Sensor Modules Interconnected with SLID Technology Irradiated to a Fluence of 2$\cdot 10^{15}$\,n$_{\mathrm{eq}}$/cm$^2$
Authors:
P. Weigell,
L. Andricek,
M. Beimforde,
A. Macchiolo,
H. -G. Moser,
R. Nisius,
R. -H. Richter
Abstract:
A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS…
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A new module concept for future ATLAS pixel detector upgrades is presented, where thin n-in-p silicon sensors are connected to the front-end chip exploiting the novel Solid Liquid Interdiffusion technique (SLID) and the signals are read out via Inter Chip Vias (ICV) etched through the front-end. This should serve as a proof of principle for future four-side buttable pixel assemblies for the ATLAS upgrades, without the cantilever presently needed in the chip for the wire bonding.
The SLID interconnection, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It is characterized by a very thin eutectic Cu-Sn alloy and allows for stacking of different layers of chips on top of the first one, without destroying the pre-existing bonds. This paves the way for vertical integration technologies.
Results of the characterization of the first pixel modules interconnected through SLID as well as of one sample irradiated to $2\cdot10^{15}$\,\neqcm{} are discussed.
Additionally, the etching of ICV into the front-end wafers was started. ICVs will be used to route the signals vertically through the front-end chip, to newly created pads on the backside. In the EMFT approach the chip wafer is thinned to (50--60)\,$μ$m.
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Submitted 23 December, 2011; v1 submitted 15 September, 2011;
originally announced September 2011.
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Characterization and Performance of Silicon n-in-p Pixel Detectors for the ATLAS Upgrades
Authors:
Philipp Weigell,
Michael Beimforde,
Christian Gallrapp,
Alessandro La Rosa,
Anna Macchiolo,
Richard Nisius,
Heinz Pernegger,
Rainer Richter
Abstract:
The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities (super LHC) the development of new structures and materials which can cope with the resulting particle fluences is needed. N-in-p silicon devices are a promising c…
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The existing ATLAS Tracker will be at its functional limit for particle fluences of 10^15 neq/cm^2 (LHC). Thus for the upgrades at smaller radii like in the case of the planned Insertable B-Layer (IBL) and for increased LHC luminosities (super LHC) the development of new structures and materials which can cope with the resulting particle fluences is needed. N-in-p silicon devices are a promising candidate for tracking detectors to achieve these goals, since they are radiation hard, cost efficient and are not type inverted after irradiation. A n-in-p pixel production based on a MPP/HLL design and performed by CiS (Erfurt, Germany) on 300 μm thick Float-Zone material is characterised and the electrical properties of sensors and single chip modules (SCM) are presented, including noise, charge collection efficiencies, and measurements with MIPs as well as an 241Am source. The SCMs are built with sensors connected to the current the ATLAS read-out chip FE-I3. The characterisation has been performed with the ATLAS pixel read-out systems, before and after irradiation with 24 GeV/c protons. In addition preliminary testbeam results for the tracking efficiency and charge collection, obtained with a SCM, are discussed.
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Submitted 16 April, 2011; v1 submitted 16 December, 2010;
originally announced December 2010.
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Expected Performance of the ATLAS Experiment - Detector, Trigger and Physics
Authors:
The ATLAS Collaboration,
G. Aad,
E. Abat,
B. Abbott,
J. Abdallah,
A. A. Abdelalim,
A. Abdesselam,
O. Abdinov,
B. Abi,
M. Abolins,
H. Abramowicz,
B. S. Acharya,
D. L. Adams,
T. N. Addy,
C. Adorisio,
P. Adragna,
T. Adye,
J. A. Aguilar-Saavedra,
M. Aharrouche,
S. P. Ahlen,
F. Ahles,
A. Ahmad,
H. Ahmed,
G. Aielli,
T. Akdogan
, et al. (2587 additional authors not shown)
Abstract:
A detailed study is presented of the expected performance of the ATLAS detector. The reconstruction of tracks, leptons, photons, missing energy and jets is investigated, together with the performance of b-tagging and the trigger. The physics potential for a variety of interesting physics processes, within the Standard Model and beyond, is examined. The study comprises a series of notes based on…
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A detailed study is presented of the expected performance of the ATLAS detector. The reconstruction of tracks, leptons, photons, missing energy and jets is investigated, together with the performance of b-tagging and the trigger. The physics potential for a variety of interesting physics processes, within the Standard Model and beyond, is examined. The study comprises a series of notes based on simulations of the detector and physics processes, with particular emphasis given to the data expected from the first years of operation of the LHC at CERN.
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Submitted 14 August, 2009; v1 submitted 28 December, 2008;
originally announced January 2009.
