Skip to main content
Cornell University
We gratefully acknowledge support from the Simons Foundation, member institutions, and all contributors. Donate
arxiv logo > cs.OH

Help | Advanced Search

arXiv logo
Cornell University Logo

quick links

  • Login
  • Help Pages
  • About

Other Computer Science

Authors and titles for February 2008

Total of 71 entries : 1-50 51-71
Showing up to 50 entries per page: fewer | more | all
[1] arXiv:0802.0188 [pdf, other]
Title: Partitioning the Threads of a Mobile System
Jérôme Feret
Subjects: Other Computer Science (cs.OH)
[2] arXiv:0802.2371 [pdf, other]
Title: Generic and Typical Ranks of Three-Way Arrays
P. Comon, J. ten Berge
Subjects: Other Computer Science (cs.OH); Mathematical Software (cs.MS)
[3] arXiv:0802.2828 [pdf, other]
Title: Structural aspects of tilings
Alexis Ballier (LIF), Bruno Durand (LIF), Emmanuel Jeandel (LIF)
Comments: 11 pages
Journal-ref: Dans Proceedings of the 25th Annual Symposium on the Theoretical Aspects of Computer Science - STACS 2008, Bordeaux : France (2008)
Subjects: Other Computer Science (cs.OH)
[4] arXiv:0802.3037 [pdf, other]
Title: Fabrication of Miniaturized Variable-focus Lens Using Liquid Filling Technique
Hsiharng Yang, Chung-Yao Yang, Mau-Shiun Yeh
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[5] arXiv:0802.3038 [pdf, other]
Title: A Novel X-Axis Tuning Fork Gyroscope with "8 Vertical Springs-Proofmass" Structure on (111)-Silicon
Fei Duan, Jiwei Jiao, Yucai Wang, Ying Zhang, Binwei Mi, Jinpeng Li, Jian Zhu, Yuelin Wang
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[6] arXiv:0802.3040 [pdf, other]
Title: Fabrication of MEMS Resonators in Thin SOI
D. Grogg, Nicoleta Diana Badila-Ciressan, Adrian Mihai Ionescu
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[7] arXiv:0802.3041 [pdf, other]
Title: Usage of Porous Al2O3 Layers for RH Sensing
Veronika Timár-Horváth, László Juhász, András Vass-Várnai, Gergely Perlaky
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[8] arXiv:0802.3042 [pdf, other]
Title: Modeling of large area hot embossing
M. Worgull, K.K. Kabanemi, J.-P. Marcotte, J.-F. Hétu, M. Heckele
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[9] arXiv:0802.3043 [pdf, other]
Title: Liquid Density Sensing Using Resonant Flexural Plate Wave Device with Sol-Gel PZT Thin Films
Jyh-Cheng Yu, Huang-Yao Lin
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[10] arXiv:0802.3044 [pdf, other]
Title: Design, Fabrication and Characterization of a Piezoelectric Microgenerator Including a Power Management Circuit
M. Marzencki (TIMA), Y. Ammar (TIMA), S. Basrour (TIMA)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[11] arXiv:0802.3046 [pdf, other]
Title: A complete study of electroactive polymers for energy scavenging: modelling and experiments
C. Jean-Mistral (LETI), S. Basrour (TIMA), J.J. Chaillout (LETI), A. Bonvilain (TIMA)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[12] arXiv:0802.3047 [pdf, other]
Title: Step-up converter for electromagnetic vibrational energy scavenger
C. Saha, T. O'Donnell, J. Godsell, L. Carlioz, N. Wang, P. Mccloskey, S. Beeby, J. Tudor, Russel Torah
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[13] arXiv:0802.3048 [pdf, other]
Title: Gas Damping Coefficient Research for MEMS Comb Linear Vibration Gyroscope
G. Qiufen, G. Yuansheng, S. Feng, L. Fuqiang
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[14] arXiv:0802.3049 [pdf, other]
Title: Comparison of Two Low-Power Electronic Interfaces for Capacitive Mems Sensors
G. Nagy, Z. Szucs, S. Hodossy, M. Rencz, A. Poppe
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[15] arXiv:0802.3050 [pdf, other]
Title: High Efficiency 3-Phase Cmos Rectifier with Step Up and Regulated
J.-C. Crebier (G2ELab), Y. Lembeye (G2ELab), H. Raisigel (G2ELab), O. Deleage (G2ELab), J. Delamare (G2ELab), O. Cugat (G2ELab)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[16] arXiv:0802.3051 [pdf, other]
Title: Silicon on Nothing Mems Electromechanical Resonator
C. Durand (ST-Crolles, Leti, Iemn), F. Casset (LETI), P. Ancey (ST-Crolles), F. Judong (ST-Crolles), A. Talbot (ST-Crolles), R. Quenouillere (LETI), D. Renaud (LETI), S. Borel (LETI), B. Florin (LETI), L. Buchaillot (IEMN)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[17] arXiv:0802.3052 [pdf, other]
Title: Copper Planar Microcoils Applied to Magnetic Actuation
J. Moulin (IEF), M. Woytasik (IEF), E. Martincic (IEF), E. Dufour-Gergam (IEF)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[18] arXiv:0802.3053 [pdf, other]
Title: Ni-MH battery modelling for ambient intelligence applications
D. Szente-Varga, D. Horvath, M. Rencz
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[19] arXiv:0802.3054 [pdf, other]
Title: Analysis of polysilicon micro beams buckling with temperature-dependent properties
M. Shamshirsaz, M. Bahrami, M.B. Asgari, M. Tayefeh
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[20] arXiv:0802.3055 [pdf, other]
Title: Parameter Identification of Pressure Sensors by Static and Dynamic Measurements
S. Michael, S. Kurth, J. Klattenhoff, H. Geissler, S. Hering
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[21] arXiv:0802.3056 [pdf, other]
Title: New Horizontal Frustum Optical Waveguide Fabrication Using UV Proximity Printing
T.-H. Lin, H. Yang, Ruey Fang Shyu, C.-K. Chao
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[22] arXiv:0802.3057 [pdf, other]
Title: A Fully Parameterized Fem Model for Electromagnetic Optimization of an RF Mems Wafer Level Package
J. Iannacci, J. Tian, R. Gaddi, A. Gnudi, M. Bartek
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[23] arXiv:0802.3059 [pdf, other]
Title: Development of a Nanostructual Microwave Probe Based on GaAs
Y. Ju, T. Kobayashi, H. Soyama
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[24] arXiv:0802.3060 [pdf, other]
Title: Characterisation of an Electrostatic Vibration Harvester
T. Sterken, Geert Altena, P. Fiorini, R. Puers
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[25] arXiv:0802.3061 [pdf, other]
Title: Surface Generation Analysis in Micro End-Milling Considering the Influences of Grain
J. Wang (LGIPM), Y. Gong, G. Abba (LGIPM), Kui Chen, J. Shi, G. Cai
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[26] arXiv:0802.3062 [pdf, other]
Title: An Integrated Circuit Compatible Compact Package for Thermal Gas Flowmeters
P. Bruschi, V. Nurra
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[27] arXiv:0802.3063 [pdf, other]
Title: A High Power Density Electrostatic Vibration-to-Electric Energy Converter Based On An In-Plane Overlap Plate (IPOP) Mechanism
A.M. Paracha (ESYCOM-Esiee), Ph. Basset (ESYCOM-Esiee), F. Marty (ESYCOM-Esiee), A. Vaisman Chasin (ESYCOM-Esiee), P. Poulichet (ESYCOM-Esiee), T. Bourouina (ESYCOM-Esiee)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[28] arXiv:0802.3064 [pdf, other]
Title: Formation of Embedded Microstructures by Thermal Activated Solvent Bonding
S.H. Ng, R.T. Tjeung, Z.F. Wang, A.C.W. Lu, I. Rodriguez, N. De Rooij
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[29] arXiv:0802.3065 [pdf, other]
Title: Design and Modeling of Micromechanical GaAs based Hot Plate for Gas Sensors
J. Jakovenko, M. Husak, T. Lalinskytfh, M. Drzik, G. Vanko
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[30] arXiv:0802.3066 [pdf, other]
Title: Set-up and characterization of a humidity sensor realized in LTCC-technology
W. Smetana, M. Unger
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[31] arXiv:0802.3067 [pdf, other]
Title: Micromachined Polycrystalline Sige-Based Thermopiles for Micropower Generation on Human Body
Z. Wang, V. Leonov, P. Fiorini, C. Van Hoof
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[32] arXiv:0802.3068 [pdf, other]
Title: Silicon microneedles array with biodegradable tips for transdermal drug delivery
B. Chen, J. Wei, Francis Tay, Y.T. Wong, C. Iliescu
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[33] arXiv:0802.3069 [pdf, other]
Title: 2-D Analysis of Enhancement of Analytes Adsorption Due to Flow Stirring by Electrothermal Force in The Microcantilever Sensor
M.C. Wu, J.S. Chang, C.-K. Yang
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[34] arXiv:0802.3070 [pdf, other]
Title: Development and Application of a Diaphragm Micro-Pump with Piezoelectric Device
H.K. Ma, B.R. Hou, H.Y. Wu, C.Y. Lin, J.J. Gao, M.C. Kou
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[35] arXiv:0802.3071 [pdf, other]
Title: Simulation of valveless micropump and mode analysis
W.P. Lan, J.S. Chang, K.C. Wu, Y.C. Shih
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, Lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[36] arXiv:0802.3072 [pdf, other]
Title: Enhanced Sensing Characteristics in MEMS-based Formaldehyde Gas Sensor
Yu-Hsiang Wang, C.-C. Hsiao, Chia-Yen Lee, R.-H. Ma, Po-Cheng Chou
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[37] arXiv:0802.3073 [pdf, other]
Title: Mems Q-Factor Enhancement Using Parametric Amplification: Theoretical Study and Design of a Parametric Device
L. Grasser (IEF), H. Mathias (IEF), F. Parrain (IEF), X. Le Roux (IEF), J.-P. Gilles (IEF)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[38] arXiv:0802.3074 [pdf, other]
Title: Biodegradable Polylactic Acid (PLA) Microstructures for Scaffold Applications
G.-J. Wang, K.-H. Ho, C.-C. Hsueh
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[39] arXiv:0802.3075 [pdf, other]
Title: Solving functional reliability issue for an optical electrostatic switch
H. Camon (LAAS), C. Ganibal (LAAS), N. Rapahoz, M. Trzmiel, C. Pisella, C. Martinez (LETI), K. Gilbert (LETI), S. Valette (LETI)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[40] arXiv:0802.3076 [pdf, other]
Title: Identification of Test Structures for Reduced Order Modeling of the Squeeze Film Damping in Mems
A. Soma, G. De Pasquale
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[41] arXiv:0802.3077 [pdf, other]
Title: Out-of-Plane Cmos Compatible Magnetometers
M. El Ghorba, N. André, S. Sobieski, J.-P. Raskin
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[42] arXiv:0802.3078 [pdf, other]
Title: Tuneable Capacitor based on dual picks profile of the sacrificial layer
S. Soulimane (LETI), F. Casset (LETI), F. Chapuis (LETI), P.-L. Charvet (LETI), M. aïd (LETI)
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[43] arXiv:0802.3079 [pdf, other]
Title: Reduced 30% scanning time 3D multiplexer integrated circuit applied to large array format 20KHZ frequency inkjet print heads
J.-C. Liou, F.-G. Tseng
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[44] arXiv:0802.3080 [pdf, other]
Title: Analysis of Asymmetric Piezoelectric Composite Beam
J.-S. Chen, S.-H. Chen, K.-C. Wu
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[45] arXiv:0802.3081 [pdf, other]
Title: A High-Q Microwave MEMS Resonator
Z. Jian, Y. Yuanwei, Z. Yong, Chen Chen, J. Shixing
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[46] arXiv:0802.3082 [pdf, other]
Title: Lamination And Microstructuring Technology for a Bio-Cell Multiwell array
E. Jung, D. Manessis, A. Neumann, L. Bottcher, T. Braun, J. Bauer, H. Reichl, B. Iafelice, F. Destro, R. Gambari
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[47] arXiv:0802.3083 [pdf, other]
Title: Monotonic and fatigue testing of spring-bridged freestanding microbeams application for MEMS
Ming-Tzer Lin, K.-S. Shiu, Chi-Jia Tong
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[48] arXiv:0802.3085 [pdf, other]
Title: Profile Control of a Borosilicate-Glass Groove Formed by Deep Reactive Ion Etching
T. Akashi, Y. Yoshimura
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[49] arXiv:0802.3086 [pdf, other]
Title: Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging
A.A. Hamzah, Y. Husaini, Y. Husaini, B.Y. Majlis, I. Ahmad
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
[50] arXiv:0802.3087 [pdf, other]
Title: A Two-Step Etching Method to Fabricate Nanopores in Silicon
G.-J. Wang, W.-Z. Chen, K.J. Chang
Comments: Submitted on behalf of EDA Publishing Association (this http URL)
Journal-ref: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Subjects: Other Computer Science (cs.OH)
Total of 71 entries : 1-50 51-71
Showing up to 50 entries per page: fewer | more | all
  • About
  • Help
  • contact arXivClick here to contact arXiv Contact
  • subscribe to arXiv mailingsClick here to subscribe Subscribe
  • Copyright
  • Privacy Policy
  • Web Accessibility Assistance
  • arXiv Operational Status
    Get status notifications via email or slack