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Condensed Matter > Materials Science

arXiv:2412.06048 (cond-mat)
[Submitted on 8 Dec 2024]

Title:Reduction in Thermal Conductivity of Monolayer MoS2 by Large Mechanical Strains for Efficient Thermal Management

Authors:Jun Liu, Mengqi Fang, Eui-Hyeok Yang, Xian Zhang
View a PDF of the paper titled Reduction in Thermal Conductivity of Monolayer MoS2 by Large Mechanical Strains for Efficient Thermal Management, by Jun Liu and 3 other authors
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Abstract:Two dimensional (2D) materials such as graphene and transition metal dichalcogenides (TMDC) have received extensive research interests and investigations in the past decade. In this research, we report the first experimental measurement of the in plane thermal conductivity of MoS2 monolayer under a large mechanical strain using optothermal Raman technique. This measurement technique is direct without additional processing to the material, and MoS2's absorption coefficient is discovered during the measurement process to further increase this technique's precision. Tunable uniaxial tensile strains are applied on the MoS2 monolayer by stretching a flexible substrate it sits on. Experimental results demonstrate that, the thermal conductivity is substantially suppressed by tensile strains: under the tensile strain of 6.3%, the thermal conductivity of the MoS2 monolayer drops approximately by 62%. A serious of thermal transport properties at a group of mechanical strains are also reported, presenting a strain dependent trend. It is the first and original study of 2D materials' thermal transport properties under a large mechanical strain, and provides important information that the thermal transport of MoS2 will significantly decrease at a large mechanical strain. This finding provides the key information for flexible and wearable electronics thermal management and designs.
Subjects: Materials Science (cond-mat.mtrl-sci); Mesoscale and Nanoscale Physics (cond-mat.mes-hall)
Cite as: arXiv:2412.06048 [cond-mat.mtrl-sci]
  (or arXiv:2412.06048v1 [cond-mat.mtrl-sci] for this version)
  https://doi.org/10.48550/arXiv.2412.06048
arXiv-issued DOI via DataCite

Submission history

From: Xian Zhang [view email]
[v1] Sun, 8 Dec 2024 19:57:31 UTC (546 KB)
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